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MPC8555PXAPF

PowerQUICC??III Integrated Communications Processor Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555PXAPF

包裝:卷帶(TR) 封裝/外殼:783-BBGA,F(xiàn)CBGA 類別:集成電路(IC) 微處理器 描述:IC MPU MPC85XX 833MHZ 783FCBGA

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

MPC8555PXAQD

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555PXAQE

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555PXAQF

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAJD

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAJE

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAJF

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAKD

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAKE

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAKF

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTALD

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTALE

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTALF

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAPD

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAPE

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAPF

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAQD

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAQE

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8555VTAQF

PowerQUICC??IIIIntegratedCommunicationsProcessorHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

產(chǎn)品屬性

  • 產(chǎn)品編號:

    MPC8555PXAPF

  • 制造商:

    NXP USA Inc.

  • 類別:

    集成電路(IC) > 微處理器

  • 系列:

    MPC85xx

  • 包裝:

    卷帶(TR)

  • 核心處理器:

    PowerPC e500

  • 內(nèi)核數(shù)/總線寬度:

    1 核,32 位

  • 速度:

    833MHz

  • 協(xié)處理器/DSP:

    通信;CPM

  • RAM 控制器:

    DDR,SDRAM

  • 圖形加速:

  • 以太網(wǎng):

    10/100/1000Mbps(2)

  • USB:

    USB 2.0(1)

  • 電壓 - I/O:

    2.5V,3.3V

  • 工作溫度:

    0°C ~ 105°C(TA)

  • 封裝/外殼:

    783-BBGA,F(xiàn)CBGA

  • 供應(yīng)商器件封裝:

    783-FCPBGA(29x29)

  • 描述:

    IC MPU MPC85XX 833MHZ 783FCBGA

供應(yīng)商型號品牌批號封裝庫存備注價格
FREESCAL
23+
BGA
19726
詢價
Freescale
16+
783-FCPBGA
108
原裝現(xiàn)貨假一罰十
詢價
FREESCALE
22+
FCPBGA78329S
2000
原裝現(xiàn)貨庫存.價格優(yōu)勢
詢價
NXP
21+
783-FCPBGA(29x29)
800
100%全新原裝 亞太地區(qū)XILINX、FREESCALE-NXP AD專業(yè)
詢價
NXP USA Inc.
21+
783-FCPBGA(29x29)
53200
一級代理/放心采購
詢價
NXP
23+
783FCPBGA
4568
原廠原裝正品現(xiàn)貨,代理渠道,支持訂貨!!!
詢價
NXP
20+
BGA-783
36
就找我吧!--邀您體驗愉快問購元件!
詢價
FREESCALE
19+20+
原裝
8384
全新原裝房間現(xiàn)貨 可長期供貨
詢價
Freescale Semiconductor - NXP
23+
783-BBGA
11200
主營:汽車電子,停產(chǎn)物料,軍工IC
詢價
NXP
22+
783FCPBGA
9000
原廠渠道,現(xiàn)貨配單
詢價
更多MPC8555PXAPF供應(yīng)商 更新時間2024-11-16 17:15:00