HMC709LC5RF/IF射頻/中頻RFID的RFIC模塊規(guī)格書(shū)PDF中文資料

HMC709LC5屬于RF/IF射頻/中頻RFID的RFIC模塊。由亞德諾半導(dǎo)體技術(shù)有限公司制造生產(chǎn)的HMC709LC5RF 其它 IC 和模塊RF 其它 IC 和模塊產(chǎn)品系列包含各種獨(dú)特、專門或特定用途的產(chǎn)品，可與 RF、IF 和微波無(wú)線電應(yīng)用結(jié)合使用。示例包括 AM/FM 調(diào)諧器和接收器、偏置網(wǎng)絡(luò)、基帶處理器、計(jì)數(shù)器、數(shù)字可調(diào)電容器、下變頻器、倍頻器、移相器、前置分頻器、端接器、上變頻器、VCO 等。

General Description

The HMC709LC5 is a compact GaAs MMIC I/Q upconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 13 dB with -20 dBc of sideband rejection. The HMC709LC5 utilizes a driver amplifier preceded by an I/Q mixer which is driven by an LO buffer amplifier. IF1 and IF2 mixer inputs are provided and an external 90° hybrid is needed to select the required sideband. The I/Q mixer topology reduces the need for filtering of the unwanted sideband. The HMC709LC5 is a much smaller alternative to hybrid style single sideband upconverter assemblies and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.

Features

High Conversion Gain: 13 dB

Sideband Rejection: -20 dBc

LO to RF Isolation: 10 dB

Output IP3: +26 dBm

32 Lead 5x5mm SMT Package: 25mm2

Typical Applications

The HMC709LC5 is ideal for:

? Point-to-Point and Point-to-Multi-Point Radio

? Military Radar, EW & ELINT

? Ku Band VSAT Upconverters

? Sensors

? Test & Measurement Equipment