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CPD

Packaging specifications

surfacemountingtype

ROHMRohm

羅姆羅姆半導(dǎo)體集團(tuán)

CPD04

General Purpose Rectifier 500 mA Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize26x26MILS DieThickness8.5MILS AnodeBondingPadArea14x14MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/Au-5,000?/2,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD05

General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize51x51MILS DieThickness10.2MILS AnodeBondingPadArea36x36MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/Au-5,000?/2,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD06

General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize89x89MILS DieThickness10.2MILS AnodeBondingPadArea66x66MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/Au-5,000?/2,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD07

General Purpose Rectifier 8 Amp Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize98x98MILS DieThickness10.4MILS AnodeBondingPadArea82.5x82.5MILS TopSideMetalizationAu-5,000? BackSideMetalizationAu-2,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD102X

Schottky Diode High Voltage Schottky Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize9.0x9.0MILS DieThickness5.9MILS AnodeBondingPadArea4.8MILSDIAMETER TopSideMetalizationAl-30,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD104R

Schottky Diode Low VF Schottky Diode Chip

PROCESSDETAILS DieSize14.6x14.6MILS DieThickness3.9MILS AnodeBondingPadArea11.8x11.8MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD106R

Schottky Diode Chip

PROCESSDETAILS DieSize8.3x8.3MILS DieThickness3.9MILS AnodeBondingPadArea5.4x5.4MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD109R

Low VF Schottky Diode Chip

PROCESSDETAILS DieSize8.3x8.3MILS DieThickness3.9MILS AnodeBondingPadArea5.4x5.4MILS TopSideMetalizationAl-20,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CPD1415B

Inductor for Digital AMP

Features： Corematerial:Ferrite Coreandwindingloss: www.codaca.com/DesignTool_Power-Inductor-Loss-Comparison.html Environmental:RoHScompliant,halogenfree Weight:13.05g MoistureSensitivity:Level(MSL)1 (unlimitedfloorlifeat

CODACAShenzhen Codaca Electronic Co.,Ltd

科達(dá)嘉電子深圳市科達(dá)嘉電子有限公司

詳細(xì)參數(shù)

  • 型號(hào)：

    CPD

  • 制造商：

    ROHM

  • 制造商全稱：

    Rohm

  • 功能描述：

    Packaging specifications

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
COMCHIP
23+
SMD
30000
原裝正品,假一罰十
 詢價(jià)
Comchip/典琦科技
22+
DFN1006-2
239179
原裝正品現(xiàn)貨,可開13個(gè)點(diǎn)稅
 詢價(jià)
COMCHIP/典琦科技
22+
SOD-523
12245
現(xiàn)貨,原廠原裝假一罰十!
 詢價(jià)
原裝COMCHIP
24+
WBFBP-02C-C
5000
全現(xiàn)原裝公司現(xiàn)貨
 詢價(jià)
COMCHIP/典琦科技
23+
BGA
20000
原裝正品 歡迎咨詢
 詢價(jià)
Crystek
20+
直插式
960
無(wú)線通信IC,大量現(xiàn)貨!
 詢價(jià)
COMCHIP
2020+
SLP2510
80000
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開13%增
 詢價(jià)
Comchip
2023+
0402/SOD-923F
6000
原裝正品現(xiàn)貨、支持第三方檢驗(yàn)、終端BOM表可配單提供
 詢價(jià)
INTERSIL
94+
SOP20
3600
全新原裝進(jìn)口自己庫(kù)存優(yōu)勢(shì)
 詢價(jià)
Bychip/百域芯
21+
SOD923
30000
優(yōu)勢(shì)供應(yīng) 品質(zhì)保障 可開13點(diǎn)發(fā)票
 詢價(jià)
更多CPD供應(yīng)商 更新時(shí)間2025-4-12 15:36:00

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