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CP2540-7R

120...195 Watt DC-DC Converters

120...195WattDC-DCConverters Inputvoltageupto150VDC1to4isolatedoutputs3.3...96VDC4242VDCI/Oelectricstrengthtestvoltage ?Extremelyslimcase(4TE),fullyenclosed ?Extremelylowinrushcurrent,hotswappable ?Operatingambienttemperaturerange –40..

POWER-ONE

Power-One

CP257

Small Signal Transistor NPN - High Voltage Darlington Transistor Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize20x20MILS DieThickness8.0MILS BaseBondingPadArea4.9x4.9MILS EmitterBondingPadArea6.4x6.4MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-16,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CP2660-7R

P Series Data Sheet 90 ??195 Watt DC-DC Converters

120...195WattDC-DCConverters Inputvoltageupto150VDC1to4isolatedoutputs3.3...96VDC4242VDCI/Oelectricstrengthtestvoltage ?Extremelyslimcase(4TE),fullyenclosed ?Extremelylowinrushcurrent,hotswappable ?Operatingambienttemperaturerange –40..

POWER-ONE

Power-One

CP268

Power Transistor NPN - High Voltage Transistor Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize63x63MILS DieThickness10MILS BaseBondingPadArea9x12MILS EmitterBondingPadArea10x18MILS TopSideMetalizationAl-16,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CP273

Power Transistor NPN- Silicon Power Transistor Chip

PROCESSDETAILS DieSize68x68MILS DieThickness8.5MILS±0.6MILS BaseBondingPadArea17.7x10.2MILS EmitterBondingPadArea18.1x8.9MILS TopSideMetalizationAl-30,000? BackSideMetalizationAg-14,000?

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CP275

Power Transistor 4.0 Amp NPN Silicon Power Transistor Chip

PowerTransistor 4.0AmpNPNSiliconPowerTransistorChip PROCESSDETAILS DieSize105x105MILS DieThickness8.5MILS BaseBondingPadArea32x19MILS EmitterBondingPadArea28x22MILS TopSideMetalizationAl

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CP28-2

PELTIER MODULE

DESCRIPTION:PELTIERMODULE FEATURES ?solidstatedevice ?2-stagecooler ?precisetemperaturecontrol ?quietoperation

CUI

CUI Inc.

CP283

Power Transistor NPN - Silicon Power Transistor Chip

PROCESSDETAILS DieSize68x68MILS DieThickness9.5MILS BaseBondingPadArea18x11MILS EmitterBondingPadArea18x12MILS TopSideMetalizationAl-45,000? BackSideMetalizationTi/Ni/Ag-(3000?,10,000?,10,000?)

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CP28372-2

PELTIER MODULE

DESCRIPTION:PELTIERMODULE FEATURES ?solidstatedevice ?2-stagecooler ?precisetemperaturecontrol ?quietoperation

CUI

CUI Inc.

CP285

Power Transistor 4.0 Amp NPN Silicon Power Transistor Chip

PROCESSDETAILS DieSize105x105MILS DieThickness9.5MILS BaseBondingPadArea32x22MILS EmitterBondingPadArea33x24MILS TopSideMetalizationAl-45,000? BackSideMetalizationTi/Ni/Ag-(3000?,10,000?,10,000?)

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

詳細(xì)參數(shù)

  • 型號(hào)：

    CP2

  • 制造商：

    Curtis Industries

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
CHIPHOM
2020+
MSOP8
196
百分百原裝正品 真實(shí)公司現(xiàn)貨庫(kù)存 本公司只做原裝 可
 詢(xún)價(jià)
PHILIPS
23+
TQFP
2500
絕對(duì)全新原裝!現(xiàn)貨!特價(jià)!請(qǐng)放心訂購(gòu)!
 詢(xún)價(jià)
ACXC
24+
1115
詢(xún)價(jià)
三菱
10+
主營(yíng)模塊
500
原裝正品,絕對(duì)正品,現(xiàn)貨供應(yīng)
 詢(xún)價(jià)
MICROCHIP
24+
SOP
30675
原裝新到貨特價(jià)
 詢(xún)價(jià)
SILICON
07+
MLP
3300
全新原裝現(xiàn)貨100真實(shí)自己公司
 詢(xún)價(jià)
SILICON
1902+
QFN
2734
代理品牌
 詢(xún)價(jià)
Hoffman
新
10
全新原裝 貨期兩周
 詢(xún)價(jià)
CHIPHOMER
15+
CSP9
12000
原裝現(xiàn)貨價(jià)格有優(yōu)勢(shì)量大可以發(fā)貨
 詢(xún)價(jià)
CHIPHOMER
24+
QN20SS
5000
全現(xiàn)原裝公司現(xiàn)貨
 詢(xún)價(jià)
更多CP2供應(yīng)商 更新時(shí)間2025-4-20 13:58:00

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