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CDBER0130L

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0130R

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0130R-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130

SMDSchottkyBarrierDiode

Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. P

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableper

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130L

SMDSchottkyBarrierDiode

Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,so

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130R

SMDSchottkyBarrierDiode

Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130R-HF

SMDSchottkyBarrierDiode

Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

詳細(xì)參數(shù)

  • 型號(hào)：

    CCLM0130TR

  • 制造商：

    Central Semiconductor Corp

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
Central
24+
原廠封裝
6787
原裝現(xiàn)貨
 詢價(jià)
CentralSemi
1728+
SOD80
8660
只做原裝進(jìn)口,假一罰十
 詢價(jià)
CENTRALSEMI
16+
NA
8800
原裝現(xiàn)貨,貨真價(jià)優(yōu)
 詢價(jià)
CENTRALSEMI
2020+
原廠封裝
35000
100%進(jìn)口原裝正品公司現(xiàn)貨庫(kù)存
 詢價(jià)
Central Semi
2023+
DIPSOP
8700
原裝現(xiàn)貨
 詢價(jià)
DSD
23+
NA
2986
專做原裝正品,假一罰百!
 詢價(jià)
CENTRALSE
NA
16355
一級(jí)代理 原裝正品假一罰十價(jià)格優(yōu)勢(shì)長(zhǎng)期供貨
 詢價(jià)
central
24+
500000
行業(yè)低價(jià),代理渠道
 詢價(jià)
Central Semi
2022+
原廠原包裝
8600
全新原裝 支持表配單 中國(guó)著名電子元器件獨(dú)立分銷
 詢價(jià)
CENTRAL
23+
SMD
251600
原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種
 詢價(jià)
更多CCLM0130TR供應(yīng)商 更新時(shí)間2025-3-24 15:20:00

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