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零件編號(hào)	下載&訂購(gòu)	功能描述	制造商&上傳企業(yè)	LOGO
CDBER0130L-HF	文件：202.23 Kbytes Page：4 Pages	SMD Schottky Barrier Diode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0130L-HF	文件：100 bytes Page：1 Pages	Package：0503（1308 公制）；包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶類別：分立半導(dǎo)體產(chǎn)品二極管 - 整流器 - 單描述：DIODE SCHOTTKY 30V 100MA 0503	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0130R	文件：201.26 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0130R-HF	文件：130.97 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0130	文件：65.269 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. P	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0130-HF	文件：199.86 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableper	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0130L	文件：201.72 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0130L-HF	文件：201.91 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,so	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0130R	文件：202.32 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0130R-HF	文件：241.36 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130	文件：75.86 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130	文件：268.92 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130-HF	文件：268.92 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130L-HF	文件：130.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130R	文件：130.33 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage moldedplastic. -Terminals:Goldplated,solder	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0130R-HF	文件：130.72 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBN0130	文件：56.01 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method20	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L	文件：107.75 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode IO=100mA VR=30V RoHSDevice Features -Smallsurfacemountingtype. -Highreliability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountingposition:Any.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L	文件：107.75 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L-G	文件：51.88 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode ReverseVoltage:30Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?HighReliability MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycathodeband. ?Mountingposition:Any. ?Marking:	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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產(chǎn)品屬性

產(chǎn)品編號(hào)：
CDBER0130L-HF
制造商：
Comchip Technology
類別：
分立半導(dǎo)體產(chǎn)品 > 二極管 - 整流器 - 單
包裝：
卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶
二極管類型：
肖特基
電流 - 平均整流 (Io)：
100mA
速度：
小信號(hào) =< 200mA（Io），任意速度
安裝類型：
表面貼裝型
封裝/外殼：
0503（1308 公制）
供應(yīng)商器件封裝：
0503/SOD-723F
工作溫度 - 結(jié)：
125°C（最大）
描述：
DIODE SCHOTTKY 30V 100MA 0503

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫(kù)存	備注	價(jià)格
深圳市科雨電子有限公司	CDBER0130L-HF	COMCHIP	1809+	SOD-723	16750	就找我吧!--邀您體驗(yàn)愉快問購(gòu)元件!	詢價(jià)
深圳市易訊博科技有限公司	CDBER0130L-HF	Comchip	22+	NA	75	加我QQ或微信咨詢更多詳細(xì)信息,	詢價(jià)
深圳市宏捷佳電子科技有限公司	CDBER0130L-HF	Comchip Technology	24+	0503/SOD-723F	9350	獨(dú)立分銷商公司只做原裝誠(chéng)心經(jīng)營(yíng) 免費(fèi)試樣正品保證	詢價(jià)
深圳硅原半導(dǎo)體有限公司	CDBER0130L整流器件	COMCHIP/典琦科技	23+	SMD	28533	原盒原標(biāo),正品現(xiàn)貨誠(chéng)信經(jīng)營(yíng) 價(jià)格美麗假一罰十!	詢價(jià)
深圳市一線半導(dǎo)體有限公司	CDBER0130R	Comchip	24+		7500	0503(1308metric)	詢價(jià)
深圳市博浩通科技有限公司	CDBER0130R	Comchip	23+	0503(1308)	7750	全新原裝優(yōu)勢(shì)	詢價(jià)
現(xiàn)代芯城（深圳）科技有限公司	CDBER0130R		24+	N/A	75000	一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇	詢價(jià)
深圳誠(chéng)思涵科技有限公司	CDBER0230L-HF	COMCHIP	16+	SOD	36000	鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥!	詢價(jià)
中天科工半導(dǎo)體（深圳）有限公司	CDBER0230L-HF	COMCHIP	20+	SOD	36800	原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開原型號(hào)增稅票	詢價(jià)
深圳市維爾達(dá)電子有限公司	CDBER0230L-HF	COMCHIP	2023+	SOD	80000	一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品	詢價(jià)

更多CDBER0130L-HF供應(yīng)商更新時(shí)間2021-9-14 10:50:00

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