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BURNDY_YF2012ID

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,20AWG,0.71L,TinPlated,Gray,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF2012IT

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,20AWG,0.71L,TinPlated,Blue,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF2012IW

ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,20AWG,0.71L,TinPlated,White,ForuseonCuCond.

HUBBELL

HUBBELL INCORPORATED

BURNDY_YF2012UI

CuAlloyBareFerrule,SmoothFunnelEntry,20AWG,0.47L,Seamlessbbl,TinPlated,ForUseOnCuCond.

HUBBELL

HUBBELL INCORPORATED

C2012

CAPACITORS

etc2List of Unclassifed Manufacturers

etc未分類制造商etc2未分類制造商

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

詳細參數(shù)

  • 型號：

    BGA2012

  • 制造商：

    NXP Semiconductors

  • 功能描述：

    BGA2012 1900MHz high linear amplifier

供應商型號品牌批號封裝庫存備注價格
NXP/恩智浦
23+
SOT-363
100586
全新原廠原裝正品現(xiàn)貨,可提供技術支持、樣品免費!
 詢價
PHILIPS
16+
SOT-363
10000
進口原裝現(xiàn)貨/價格優(yōu)勢!
 詢價
PHILIPS
17+
SOT-363
6200
100%原裝正品現(xiàn)貨
 詢價
NXP
23+
NA
5392
專做原裝正品,假一罰百!
 詢價
NEXPERIA
23+
SOT363
63000
原裝正品現(xiàn)貨
 詢價
NXP/恩智浦
23+
SOT-363
50000
全新原裝正品現(xiàn)貨,支持訂貨
 詢價
NXP
22+
SOT-363
6000
十年配單,只做原裝
 詢價
ph
24+
500000
行業(yè)低價,代理渠道
 詢價
NXP
09+
SOT363
20
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
 詢價
NXP
23+
SOT-363
12800
##公司主營品牌長期供應100%原裝現(xiàn)貨可含稅提供技術
 詢價
更多BGA2012供應商 更新時間2025-4-26 12:28:00

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