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BURNDY_YF2012UI

Cu Alloy Bare Ferrule, Smooth Funnel Entry, 20 AWG, 0.47 L, Seamless bbl, Tin Plated, For Use On Cu Cond.

HUBBELL

HUBBELL INCORPORATED

C2012

CAPACITORS

etc2List of Unclassifed Manufacturers

etc未分類制造商etc2未分類制造商

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化（中國）投資有限公司

供應商型號品牌批號封裝庫存備注價格
N/A
2447
SMD
100500
一級代理專營品牌!原裝正品,優(yōu)勢現貨,長期排單到貨
 詢價
2000
50
詢價
TI/德州儀器
23+
HTSSOP48
50000
全新原裝正品現貨,支持訂貨
 詢價
TI/德州儀器
23+
HTSSOP48
10880
原裝正品，支持實單
 詢價
TI(德州儀器)
24+
NA/
7350
現貨供應,當天可交貨!免費送樣,原廠技術支持!!!
 詢價
TI/德州儀器
24+
NA/
133
優(yōu)勢代理渠道,原裝正品,可全系列訂貨開增值稅票
 詢價
50
23+
原廠正規(guī)渠道
5000
專注配單,只做原裝進口現貨
 詢價
50
23+
原廠正規(guī)渠道
5000
專注配單,只做原裝進口現貨
 詢價
TI
25+
HTSSOP48
138
原裝正品,假一罰十!
 詢價
NXP/恩智浦
24+
SOT-23
6000
公司現貨庫存,支持實單
 詢價
更多BURNDY_YF2012UI供應商 更新時間2025-4-7 15:00:00

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