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BAM0330

Reflectors,Fibers,Optics

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團(tuán)

BCC0330

Single-EndedCordsets

Basicfeatures Approval/Conformity CE cULus EAC WEEE

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團(tuán)

BES0330

InductiveSensors

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團(tuán)

CDBF0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0330-HF

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0330-HF

SMDSchottkyBarrierDiode

Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0330-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0330-HF

SMDSchottkyBarrierDiode

Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

詳細(xì)參數(shù)

  • 型號：

    XX0330

  • 制造商：

    TE Connectivity

供應(yīng)商型號品牌批號封裝庫存備注價(jià)格
99IOT(九九物聯(lián))
2447
40x9.9mm
315000
50個/袋一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期
 詢價(jià)
99IOT(九九物聯(lián))
2021+
40x9.9mm
1224
詢價(jià)
PHILIPS
1822+
SOT-323
6852
只做原裝正品假一賠十為客戶做到零風(fēng)險(xiǎn)!!
 詢價(jià)
PHILIPS
24+
SOT-323
65200
一級代理/放心采購
 詢價(jià)
M/A-COM
24+
SMD
50
“芯達(dá)集團(tuán)”專營軍工百分之百原裝進(jìn)口
 詢價(jià)
M/A-COM
專業(yè)軍工
NA
1000
只做原裝正品軍工級部分訂貨
 詢價(jià)
10
優(yōu)勢庫存,全新原裝
 詢價(jià)
M/A-COM
24+
36000
原裝現(xiàn)貨假一賠十
 詢價(jià)
M/A-COM
23+
11200
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO
 詢價(jià)
MACOM
23+
NA
25000
##公司主營品牌長期供應(yīng)100%原裝現(xiàn)貨可含稅提供技術(shù)
 詢價(jià)
更多XX0330供應(yīng)商 更新時(shí)間2025-3-28 15:00:00

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