首頁 >XCC1354P106T0RGZ>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
XCC1354P106T0RGZ | CC1354P10 SimpleLink? High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | |
XCC1354P106T0RGZ | CC1354P10 SimpleLink? High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | |
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 | ||
CC1354P10SimpleLink?High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier 1Features Wirelessmicrocontroller ?Powerful48MHzArm?Cortex?-M33processor withTrustZone? ?FPUandDSPextension ?1024kBflashprogrammemory ?8kBofcacheSRAM ?256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TI1Texas Instruments 德州儀器 | TI1 |
| 供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
TELEMECANIQUE |
22+ |
NA |
500000 |
萬三科技,秉承原裝,購芯無憂 |
詢價 |
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