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CDBF0130

SMDSchottkyBarrierDiode

Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. P

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableper

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130L

SMDSchottkyBarrierDiode

Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,so

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130R

SMDSchottkyBarrierDiode

Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130R-HF

SMDSchottkyBarrierDiode

Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderable

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130L-HF

SMDSchottkyBarrierDiode

Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

詳細(xì)參數(shù)

  • 型號(hào)：

    WBPA0130M

  • 制造商：

    WanTcom

  • 功能描述：

    RF & MW POWER AMPLIFIER

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
Wantcom
24+
SMD
1680
Wantcom專(zhuān)營(yíng)品牌進(jìn)口原裝現(xiàn)貨假一賠十
 詢(xún)價(jià)
WANTCOM
23+
N/A
7560
原廠原裝
 詢(xún)價(jià)
WANTCOM
21+
標(biāo)準(zhǔn)封裝
500
進(jìn)口原裝,訂貨渠道!
 詢(xún)價(jià)
Wantcom
14+
WP-6
200
Wantcom核心分銷(xiāo)-軍工器件供應(yīng)商
 詢(xún)價(jià)
WANTCOM
23+
WP-6
11200
原廠授權(quán)一級(jí)代理、全球訂貨優(yōu)勢(shì)渠道、可提供一站式BO
 詢(xún)價(jià)
更多WBPA0130M供應(yīng)商 更新時(shí)間2025-3-26 17:14:00

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