首頁(yè) >W25M02GWZEIG>規(guī)格書(shū)列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
W25M02GWZEIG | 1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | |
W25M02GWZEIG | 包裝:托盤(pán) 封裝/外殼:8-WDFN 裸露焊盤(pán) 類(lèi)別:集成電路(IC) 存儲(chǔ)器 描述:IC FLASH 2GBIT SPI/QUAD 8WSON | Winbond Electronics Winbond Electronics | Winbond Electronics | |
包裝:卷帶(TR) 封裝/外殼:8-WDFN 裸露焊盤(pán) 類(lèi)別:集成電路(IC) 存儲(chǔ)器 描述:2G-BIT SERIAL NAND FLASH, 1.8V | Winbond Electronics Winbond Electronics | Winbond Electronics | ||
3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
3V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITHDUAL/QUADSPIBUFFERREAD&CONTINUOUSREADCONCURRENTOPERATIONS | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
1.8V2G-BIT(2x1G-BIT)SERIALSLCNANDFLASHMEMORYWITH GENERALDESCRIPTIONS TheW25M02GW(2x1G-bit)SerialMCP(MultiChipPackage)FlashmemoryisbasedontheW25NSerialSLCNANDSpiFlash?seriesbystackingtwoindividualW25N01GWdieintoastandard8-pinpackage.Itoffersthehighestmemorydensityforthelowpin-countpackage,aswellasC | WINBONDWinbond 華邦電子華邦電子股份有限公司 | WINBOND | ||
2MbSPISerialCMOSEEPROM | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI | ||
EEPROMSerial2-MbSPI | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI | ||
2MbSPISerialCMOSEEPROM | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI | ||
2MbSPISerialCMOSEEPROM | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI | ||
EEPROMSerial2-MbSPI | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI |
產(chǎn)品屬性
- 產(chǎn)品編號(hào):
W25M02GWZEIG
- 制造商:
Winbond Electronics
- 類(lèi)別:
集成電路(IC) > 存儲(chǔ)器
- 系列:
SpiFlash?
- 包裝:
托盤(pán)
- 存儲(chǔ)器類(lèi)型:
非易失
- 存儲(chǔ)器格式:
閃存
- 技術(shù):
FLASH - NAND(SLC)
- 存儲(chǔ)容量:
2Gb(256M x 8)
- 存儲(chǔ)器接口:
SPI - 四 I/O
- 寫(xiě)周期時(shí)間 - 字,頁(yè):
700μs
- 電壓 - 供電:
1.7V ~ 1.95V
- 工作溫度:
-40°C ~ 85°C(TA)
- 安裝類(lèi)型:
表面貼裝型
- 封裝/外殼:
8-WDFN 裸露焊盤(pán)
- 供應(yīng)商器件封裝:
8-WSON(8x6)
- 描述:
IC FLASH 2GBIT SPI/QUAD 8WSON
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
Winbond Electronics |
21+ |
NA |
11200 |
正品專(zhuān)賣(mài),進(jìn)口原裝深圳現(xiàn)貨 |
詢(xún)價(jià) | ||
winbond(華邦) |
23+ |
NA |
20094 |
正納10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品做服務(wù)做口碑有支持 |
詢(xún)價(jià) | ||
華邦 |
22+ |
NA |
500000 |
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂(yōu) |
詢(xún)價(jià) | ||
Winbond |
2022+ |
原廠原包裝 |
8600 |
全新原裝 支持表配單 中國(guó)著名電子元器件獨(dú)立分銷(xiāo) |
詢(xún)價(jià) | ||
WINBOND |
22+ |
WSON-8 8x6mm |
80000 |
華邦全線/只有原裝/價(jià)格優(yōu)勢(shì)/全線可訂 |
詢(xún)價(jià) | ||
Winbond Electronics |
23+/24+ |
8-WDFN |
8600 |
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨 |
詢(xún)價(jià) | ||
Winbond Electronics |
24+ |
8-WDFN 裸露焊盤(pán) |
9350 |
獨(dú)立分銷(xiāo)商 公司只做原裝 誠(chéng)心經(jīng)營(yíng) 免費(fèi)試樣正品保證 |
詢(xún)價(jià) | ||
WINBOND |
23+ |
原裝正品現(xiàn)貨 |
10000 |
WSON8 |
詢(xún)價(jià) | ||
22+ |
8600 |
全新正品現(xiàn)貨 有掛就有現(xiàn)貨 |
詢(xún)價(jià) | ||||
WINBOND |
24+ |
DIP |
21 |
詢(xún)價(jià) |
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