UPF1N50中文資料美高森美數(shù)據(jù)手冊PDF規(guī)格書

DESCRIPTION

Power MOSFET in ultra low profile patented Powermite 3(TM) package provides the designer with the best combination of fast Switching, ruggedized device design, low on-resistance, cost effectiveness in the industrys smallest high power surface mount package.

The UPF1N50 is ideal for ultra small motor control and switch mode power supply applications.

The Powermite 3 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. With power dissipation levels up to 1.8 Watts, the Powermite 3 offers similar power handling capability to device 4 times its size by using a patented full metal wrap around bottom.

KEY FEATURES

? POWERMITE 3 Surface Mount Package

? Low On-State Resistance

? High Frequency Switching

? Ultra Low Leakage current

? Integral Heat Sink / Locking Tabs

? Supplied in 16mm Tape and Reel – 6000 units/reel

? Superior Low Thermal And Electrical capability

APPLICATIONS/BENEFITS

? Motor Control

? Switch Mode Power Supplies