UPC2747TB-E3中文資料瑞薩數(shù)據(jù)手冊PDF規(guī)格書

DESCRIPTION

The μPC2747TB, μPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.

The μPC2747TB, μPC2748TB have compatible pin connections and performance to μPC2747T, μPC2748T of conventional minimold version. So, in the case of reducing your system size, μPC2747TB, μPC2748TB are suitable to replace from μPC2747T, μPC2748T.

These ICs are manufactured using NEC’s 20 GHz fT NESAT? lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.

FEATURES

? High-density surface mounting :

6-pin super minimold package

? Supply voltage : VCC = 2.7 to 3.3 V

? Noise figure

: μPC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz

: μPC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz

? Upper limit operating frequency

: μPC2747TB ; fu = 1.8 GHz TYP.

: μPC2748TB ; fu = 1.5 GHz TYP.

APPLICATION

? Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM)