UMF250中文資料碩特數(shù)據(jù)手冊PDF規(guī)格書

Technical Data

Rated Voltage 250 VAC, 125 VDC

Rated current 0.5 - 15 A

Breaking Capacity 100 A - 500 A

Characteristic Quick-Acting F

Mounting PCB,SMT

Admissible Ambient Air Temp. -55 °C to 125 °C

Climatic Category 55/125/21 acc. to IEC 60068-1

Material: Housing Ceramics

Material: Terminals Copper alloy, tin-plated

Unit Weight 0.23 g

Storage Conditions 0 °C to 40 °C, max. 70 r.h.

Product Marking , Rated current, Rated Voltage,

Characteristic, Breaking Capacity

Soldering Methods Reflow, Wave

Soldering Profile

Solderability 245 °C / 3 sec acc. to IEC 60068-2-58,

Test Td

Resistance to Soldering Heat 260 °C / 10 sec acc. to IEC 60068-2-58,

Test Td

Moisture Sensitivity Level MSL 1, J-STD-020

Case Resistance >100 MΩ (between leeds and body)

acc. to EIA/IS-722, Test 4.7

Flammability min. UL 94V-1

(acc. to EIA/IS-722, Test 4.12)

Moisture Resistance Test MIL-STD-202, Method 106

(acc. to EIA/IS-722, Test 4.4.3)

Operational Life 1000h @ 0.60 x In @ 70°C

(acc. to EIA/IS-722, Test 4.4.1)

Mechanical Shock MIL-STD-202, Method 213 Condition A

Resistance to Solvents MIL-STD-202, Method 215