零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
OperatingInstructions | BURKERTChristian Bürkert GmbH & Co. KG 寶帝流體控制系統(tǒng)寶帝流體控制系統(tǒng)(上海)有限公司 | BURKERT | ||
HEYClip?NylonArrowClips | HeycoHeyco. 海科???Heyco) | Heyco | ||
Powerentrymoduleswithoutlinefilter IECApplianceInletC14withFuseholder2-pole Description -PanelMount: Screw-onmountingfromfrontside -2Functions: ApplianceInletprotectionclassIorII,Fuseholderforfuse-links5x20mm,1-or2-pole -Quickconnectterminals4.8x0.8mm -Werecommend | SCHURTERSchurter Inc. 碩特碩特集團 | SCHURTER | ||
PowerCordwithIECConnectorC13,Angled | SCHURTERSchurter Inc. 碩特碩特集團 | SCHURTER | ||
PHOTO-INTERRUPTER
| Kingbright Kingbright Company LLC | Kingbright | ||
Single-EndedCordsets Basicfeatures Approval/Conformity CE cULus EAC WEEE | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
Surfacemount,silver(Ag)coatedceramicfilterforuseinbroadbandapplications. | CTSCTS Electronic Components 西迪斯西迪斯公司 | CTS | ||
PIANOSWITCHES(FULLPITCH) | COPALCopal Electronics 尼得科科智博電子尼得科科智博電子(上海)有限公司 | COPAL | ||
Broadband,LowErrorVectorMagnitude(EVM)DirectConversionTransmitterUsingLODivide-by-2Modulator | ADAnalog Devices 亞德諾亞德諾半導體技術(shù)有限公司 | AD | ||
DSDC0311 | LEDTRONICS LEDTRONICS, INC | LEDTRONICS | ||
30WUltraminiatureOpenFrameSwitchingPowerSupplies | ASTRODYNEAstrodyne Corporation 天成達天成達(昆山)電子有限公司 | ASTRODYNE | ||
PHOTO-INTERRUPTER | Kingbright Kingbright Company LLC | Kingbright | ||
LowCostSurfaceMountPlasticPackage | AVAGOAVAGO TECHNOLOGIES LIMITED 安華高 | AVAGO | ||
CascadableSiliconBipolarMMICAmplifier | BOARDCOMBroadcom Corporation. 博通公司博通半導體 | BOARDCOM | ||
CascadableSiliconBipolarMMICAmplifier Description TheMSA-0311isalowcostsiliconbipolarMonolithicMicrowaveIntegratedCircuit(MMIC)housedinthesurfacemountplasticSOT-143package.ThisMMICisdesignedforuseasageneral purpose50?gainblock.TypicalapplicationsincludenarrowandbroadbandIFandRFamplifier | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
CascadableSiliconBipolarMMICAmplifier Description TheMSA-0311isalowcostsiliconbipolarMonolithicMicrowaveIntegratedCircuit(MMIC)housedinthesurfacemountplasticSOT-143package.ThisMMICisdesignedforuseasageneral purpose50?gainblock.TypicalapplicationsincludenarrowandbroadbandIFandRFamplifier | HPAgilent(Hewlett-Packard) 安捷倫科技安捷倫科技有限公司 | HP | ||
LowCostSurfaceMountPlasticPackage | AVAGOAVAGO TECHNOLOGIES LIMITED 安華高 | AVAGO | ||
CascadableSiliconBipolarMMICAmplifier | BOARDCOMBroadcom Corporation. 博通公司博通半導體 | BOARDCOM | ||
LowCostSurfaceMountPlasticPackage | AVAGOAVAGO TECHNOLOGIES LIMITED 安華高 | AVAGO | ||
CascadableSiliconBipolarMMICAmplifier | BOARDCOMBroadcom Corporation. 博通公司博通半導體 | BOARDCOM |
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