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TOP264_V01中文資料POWERINT數(shù)據(jù)手冊PDF規(guī)格書

TOP264_V01
廠商型號

TOP264_V01

功能描述

Integrated Off-Line Switcher with EcoSmart? Technology for Highly Efficient Power Supplies

文件大小

2.46469 Mbytes

頁面數(shù)量

40

生產(chǎn)廠商 Power Integrations, Inc.
企業(yè)簡稱

POWERINT

中文名稱

荷蘭帕沃英蒂格盛有限公司官網(wǎng)

原廠標識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-14 22:58:00

TOP264_V01規(guī)格書詳情

EcoSmart – Energy Efficient

? Ideal for applications from 10 W to 245 W

? Energy efficient over entire load range

? No-load consumption below 100 mW at 265 VAC

? Up to 750 mW standby output power for 1 W input at 230 VAC

High Design Flexibility for Low System Cost

? Multi-mode PWM control maximizes efficiency at all loads

? 132 kHz operation reduces transformer and power supply size

? 66 kHz option for highest efficiency requirements

? Accurate programmable current limit

? Optimized line feed-forward for line ripple rejection

? Frequency jittering reduces EMI filter cost

? Fully integrated soft-start for minimum start-up stress

? 725 V rated MOSFET

? Simplifies meeting design derating requirements

Extensive Protection Features

? Auto-restart limits power delivery to <3 during overload faults

? Output short-circuit protection (SCP)

? Output over-current protection (OCP)

? Output overload protection (OPP)

? Output overvoltage protection (OVP)

? User programmable for hysteretic/latching shutdown

? Simple fast AC reset

? Primary or secondary sensed

? Line undervoltage (UV) detection prevents turn-off glitches

? Line overvoltage (OV) shutdown extends line surge withstand

? Accurate thermal shutdown with large hysteresis (OTP)

Advanced Package Options

? eDIP?-12 package:

? 43 W / 117 W universal input power output capability with

PCB / metal heat sink

? Low profile horizontal orientation for ultra-slim designs

? Heat transfer to both PCB and heat sink

? Optional external heat sink provides thermal impedance

equivalent to a TO-220

? eSIP?-7C package:

? 177 W universal input output power capability

? Vertical orientation for minimum PCB footprint

? Simple heat sink mounting using clip provides thermal

impedance equivalent to a TO-220

? eSOP?-12 package:

? 66 W universal input output power capability

? Low profile surface mounted for ultra-slim designs

? Heat transfer to PCB via exposed pad and SOURCE pins

? Supports wave or reflow soldering

? Extended creepage to DRAIN pin

? Heat sink is connected to SOURCE for low EMI

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