TLV75519PDQNR集成電路（IC）的線性+開關(guān)穩(wěn)壓器規(guī)格書PDF中文資料

1 Features

? SOT-23-5 package with 60.3°C/W RθJA available

? Input voltage range: 1.45V to 5.5V

? Low IQ: 25μA (typical)

? Low dropout:

– 238mV (maximum) at 500mA (3.3VOUT)

? Output accuracy: 1% (maximum at 85°C)

? Built-in soft-start with monotonic VOUT rise

? Foldback current limit

? Active output discharge

? High PSRR: 46dB at 100kHz

? Stable with a 1μF ceramic output capacitor

? Packages:

– 2.9mm × 2.8mm SOT-23-5 (DBV)

– 2.9mm × 2.8mm SOT-23-5 (DYD) with thermal

pad

– 1mm × 1mm X2SON-4 (DQN)

– 2mm × 2mm WSON-6 (DRV)

2 Applications

? Set-top boxes, TV, and gaming consoles

? Portable and battery-powered equipment

? Desktops, notebooks, and ultrabooks

? Tablets and remote controls

? White goods and appliances

? Grid infrastructure and protection relays

? Camera modules and image sensors

3 Description

The TLV755P is an ultra-small, low quiescent current,

low-dropout regulator (LDO) that sources 500mA

with good line and load transient performance.

The TLV755P is optimized for a wide variety of

applications by supporting an input voltage range

from 1.45V to 5.5V. To minimize cost and solution

size, the device is offered in fixed output voltages

ranging from 0.6V to 5V to support the lower

core voltages of modern microcontrollers (MCUs).

Additionally, the TLV755P has a low IQ with enable

functionality to minimize standby power. This device

features an internal soft-start to lower inrush current,

thus providing a controlled voltage to the load and

minimizing the input voltage drop during start up.

When shutdown, the device actively pulls down the

output to quickly discharge the outputs and provide a

known start-up state.

The TLV755P is stable with small ceramic output

capacitors allowing for a small overall solution size.

A precision band-gap and error amplifier provides

a typical accuracy of 1%. All device versions

have integrated thermal shutdown, current limit, and

undervoltage lockout (UVLO). The TLV755P has an

internal foldback current limit that helps reduce the

thermal dissipation during short-circuit events.

The TLV755 is available in the popular WSON,

X2SON, and SOT23-5 (DRV, DQN, and DBV)

packages. This device is also available in a

thermally enhanced SOT23-5 (DYD) package with

a thermal pad that provides significantly reduced

thermal resistance compared to a standard SOT23-5

package.