首頁 >T373AT>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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HIGHENERGYSPARKGAPDEVICES DESCRIPTION CPClare’sTGLegacySeriesoftwoelectrodesparkgapsexcelinapplicationsthatrequiretheefficienttransferofhighvoltage,highenergypulsesandDCovervoltageprotectionformagnetrons,diodes,capacitors,etc.TheTGLegacySeriesalsoincludesthreeelectrodetriggeredsp | Clare Clare, Inc. | Clare | ||
ThermalPad Features ?Lowelongation ?Electricalinsulation ?Easytoassemble ?Madefromsilicone,thermalconductiveparticles, fiberglass Application: ElectronicComponents-5G,Aerospace,AI,AIoT,AR/VR/MR/XR,Automotive, ConsumerDevices,Datacom,ElectricVehicle,ElectronicProducts,Energy | TGLOBAL T-Global Technology | TGLOBAL | ||
ThermalPad Application: ElectronicComponents-5G,Aerospace,AI,AIoT,AR/VR/MR/XR,Automotive, ConsumerDevices,Datacom,ElectricVehicle,ElectronicProducts,Energy Storage,Industrial,LightingEquipment,Medical,Military,Netcom,Panel,Power Electronics,Robot,Servers,SmartHome,Telecom,etc | TGLOBAL T-Global Technology | TGLOBAL | ||
ThermalPad Features ?Greatreworkability&Easytoassemble ?Highsoftnessandcompressibility ?Naturaltack ?Shock&vibrationabsorber Application: ElectronicComponents-5G,Aerospace,AI,AIoT,AR/VR/MR/XR,Automotive, ConsumerDevices,Datacom,ElectricVehicle,ElectronicProducts,Energy St | TGLOBAL T-Global Technology | TGLOBAL | ||
ThermalPad Application: ElectronicComponents-5G,Aerospace,AI,AIoT,AR/VR/MR/XR, Automotive,ConsumerDevices,Datacom,ElectricVehicle,Electronic Products,EnergyStorage,Industrial,LightingEquipment,Medical, Military,Netcom,Panel,PowerElectronics,Robot,Servers,Smart Home,Telecom,et | TGLOBAL T-Global Technology | TGLOBAL | ||
32-BitMicrocontrollers | TOSHIBAToshiba Semiconductor 東芝株式會社東芝 | TOSHIBA | ||
1Wto5WLEDDriverforMR16LED | ONSEMION Semiconductor 安森美半導(dǎo)體安森美半導(dǎo)體公司 | ONSEMI | ||
Up-DownCounters | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
IRReceiverModulesforRemoteControlSystems DESCRIPTION TheTSOP373..,TSOP375..seriesareminiaturizedreceiver modulesforinfraredremotecontrolsystems.APINdiode andapreamplifierareassembledonaPCB,theepoxy packagecontainsanIRfilter.Thedemodulatedoutput signalcanbedirectlyconnectedtoamicroprocessorfor d | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
IRReceiverModulesforRemoteControlSystems | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay |
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