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T1210-800R

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1210-800R-TR

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

PMH1210-800

MultilayerHigh-CurrentFerriteChipBeads

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T1210-800G

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mountpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramic

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1210-800G

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1210-800G

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mountpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramic

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1210-800G

12ASnubberless?,logiclevelandstandardTriacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1210-800G-TR

12ASnubberless?,logiclevelandstandardTriacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1210-800G-TR

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
16+
BGA
2500
進(jìn)口原裝現(xiàn)貨/價(jià)格優(yōu)勢(shì)!
詢(xún)價(jià)
TI
22+
QFN
22970
原裝正品現(xiàn)貨,可開(kāi)13個(gè)點(diǎn)稅
詢(xún)價(jià)
TI/德州儀器
21+
QFN
3000
百域芯優(yōu)勢(shì) 實(shí)單必成 可開(kāi)13點(diǎn)增值稅發(fā)票
詢(xún)價(jià)
TI/德州儀器
23+
QFN
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢(xún)價(jià)
TI
23+
VQFN32
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢(xún)價(jià)
TI
21+
QFN
10000
原裝現(xiàn)貨假一罰十
詢(xún)價(jià)
TI/德州儀器
24+
QFN
4500
原裝現(xiàn)貨假一賠十
詢(xún)價(jià)
TI
21+
VQFN32
13880
公司只售原裝,支持實(shí)單
詢(xún)價(jià)
TI/德州儀器
2022+
QFN
3000
原廠代理 終端免費(fèi)提供樣品
詢(xún)價(jià)
TI
21+
VQFN32
63880
本公司只售原裝 支持實(shí)單
詢(xún)價(jià)
更多T1210-800R供應(yīng)商 更新時(shí)間2025-5-17 8:30:00