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T121

Low g-sensitivity, Tight Stability

EUROQUARTZEUROQUARTZ limited

石英公司歐洲石英公司

T1210

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-600G

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-600G

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-600G-TR

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-600G-TR

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-600R

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-600R-TR

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-6G

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-6G-TR

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800G

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mountpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramic

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800G

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800G

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mountpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramic

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800G

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800G-TR

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800G-TR

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800R

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-800R-TR

12 A Snubberless?? logic level and standard triacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-8G

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

T1210-8G-TR

12 A Snubberless?, logic level and standard Triacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體(ST)集團

晶體管資料

  • 型號:

    T1210BH

  • 別名:

    三極管、晶體管、晶體三極管

  • 生產(chǎn)廠家:

  • 制作材料:

    Triac

  • 性質:

  • 封裝形式:

    直插封裝

  • 極限工作電壓:

    200V

  • 最大電流允許值:

    12A

  • 最大工作頻率:

    <1MHZ或未知

  • 引腳數(shù):

    3

  • 可代換的型號:

    TAG257-...,

  • 最大耗散功率:

  • 放大倍數(shù):

  • 圖片代號:

    B-10

  • vtest:

    200

  • htest:

    999900

  • atest:

    12

  • wtest:

    0

詳細參數(shù)

  • 型號:

    T121

  • 制造商:

    RECORD TOOLS

  • 功能描述:

    G CLAMP 10

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更多T121供應商 更新時間2024-10-28 9:06:00