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STGB30H60DLLFBAG中文資料意法半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

STGB30H60DLLFBAG
廠商型號(hào)

STGB30H60DLLFBAG

功能描述

Automotive-grade trench gate field-stop IGBT, HB series 600 V, 30 A high speed

文件大小

1.00949 Mbytes

頁(yè)面數(shù)量

17 頁(yè)

生產(chǎn)廠商 STMicroelectronics
企業(yè)簡(jiǎn)稱

STMICROELECTRONICS意法半導(dǎo)體

中文名稱

意法半導(dǎo)體集團(tuán)官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2024-12-22 17:10:00

STGB30H60DLLFBAG規(guī)格書(shū)詳情

Features

? AEC-Q101 qualified

? Maximum junction temperature: TJ = 175 °C

? Logic level gate drive

? High speed switching series

? Minimized tail current

? VCE(sat) = 1.7 V (typ.) @ IC = 30 A

? Low VF soft recovery co-packaged diode

? Tight parameters distribution

? Safer paralleling

? Low thermal resistance

Description

This device is an IGBT developed using an

advanced proprietary trench gate field-stop

structure. The device is part of the new HB series

of IGBTs, which represents an optimum

compromise between conduction and switching

loss to maximize the efficiency of any frequency

converter. Furthermore, the slightly positive

VCE(sat) temperature coefficient and very tight

parameter distribution result in safer paralleling

operation.

Applications

? Ignition

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
ST/意法半導(dǎo)體
21+
D2PAK-3
8860
原裝現(xiàn)貨,實(shí)單價(jià)優(yōu)
詢價(jià)
ST/意法半導(dǎo)體
D2PAK-3
36900
集團(tuán)化配單-有更多數(shù)量-免費(fèi)送樣-原包裝正品現(xiàn)貨-正規(guī)
詢價(jià)
ST/意法半導(dǎo)體
21+
D2PAK-3
8860
只做原裝,質(zhì)量保證
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ST/意法半導(dǎo)體
23+
D2PAK-3
12820
正規(guī)渠道,只有原裝!
詢價(jià)
ST/意法半導(dǎo)體
22+
D2PAK-3
16900
原裝現(xiàn)貨,實(shí)單價(jià)優(yōu)
詢價(jià)
ST/意法半導(dǎo)體
22+
D2PAK-3
10000
只有原裝,原裝,假一罰十
詢價(jià)
STMicroelectronics
2022+
D2PAK
38550
全新原裝 支持表配單 中國(guó)著名電子元器件獨(dú)立分銷
詢價(jià)
ST
22+
D2PAK
66900
原廠原裝現(xiàn)貨
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ST/意法半導(dǎo)體
2020+
D2PAK-3
7600
只做原裝正品,賣元器件不賺錢交個(gè)朋友
詢價(jià)
ST/意法半導(dǎo)體
21+
D2PAK-3
12820
公司只做原裝,誠(chéng)信經(jīng)營(yíng)
詢價(jià)