首頁(yè) >RZC1-04ZRS-KUB>規(guī)格書列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
RZC1-04ZRS-KUB | SENSORS FOR C-SLOT CYLINDERS | SICK SICK AG. | SICK | |
1ABRIDGERECTIFIERS | FRONTIER Frontier Electronics | FRONTIER | ||
SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000 | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
西克 |
22+ |
NA |
500000 |
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂 |
詢價(jià) | ||
24+ |
N/A |
52000 |
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇 |
詢價(jià) | |||
SICK |
23+ |
SENSOR |
128 |
全新、原裝 |
詢價(jià) | ||
TDK |
24+ |
DIP-5 |
1500 |
詢價(jià) | |||
TDK |
2016+ |
DIP5 |
2200 |
只做原裝,假一罰十,公司可開17%增值稅發(fā)票! |
詢價(jià) | ||
TDK |
23+ |
DIP5 |
8560 |
受權(quán)代理!全新原裝現(xiàn)貨特價(jià)熱賣! |
詢價(jià) | ||
TDK |
22+ |
DIP5 |
19960 |
原裝正品現(xiàn)貨 |
詢價(jià) | ||
TDK |
24+ |
DIP5 |
65200 |
一級(jí)代理/放心采購(gòu) |
詢價(jià) | ||
TDK/東電化 |
21+ |
DIP5 |
30000 |
只做正品原裝現(xiàn)貨 |
詢價(jià) | ||
TDK/東電化 |
2021+ |
DIP5 |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) |
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