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RZC1-04ZRS-KUB

SENSORS FOR C-SLOT CYLINDERS

SICK

SICK AG.

BL1-04

1ABRIDGERECTIFIERS

FRONTIER

Frontier Electronics

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CBRLD1-04

SURFACEMOUNTLOWPROFILESILICONBRIDGERECTIFIER

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMMR1-04

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS

DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
西克
22+
NA
500000
萬(wàn)三科技,秉承原裝,購(gòu)芯無(wú)憂
詢價(jià)
24+
N/A
52000
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
詢價(jià)
SICK
23+
SENSOR
128
全新、原裝
詢價(jià)
TDK
24+
DIP-5
1500
詢價(jià)
TDK
2016+
DIP5
2200
只做原裝,假一罰十,公司可開17%增值稅發(fā)票!
詢價(jià)
TDK
23+
DIP5
8560
受權(quán)代理!全新原裝現(xiàn)貨特價(jià)熱賣!
詢價(jià)
TDK
22+
DIP5
19960
原裝正品現(xiàn)貨
詢價(jià)
TDK
24+
DIP5
65200
一級(jí)代理/放心采購(gòu)
詢價(jià)
TDK/東電化
21+
DIP5
30000
只做正品原裝現(xiàn)貨
詢價(jià)
TDK/東電化
2021+
DIP5
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
詢價(jià)
更多RZC1-04ZRS-KUB供應(yīng)商 更新時(shí)間2025-1-14 15:00:00