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RD28F1602C3TD70中文資料英特爾數據手冊PDF規(guī)格書

RD28F1602C3TD70
廠商型號

RD28F1602C3TD70

功能描述

3 VOLT INTEL AdvancedBootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye

文件大小

1.22334 Mbytes

頁面數量

70

生產廠商 Intel Corporation(Integrated Electronics Corporation)
企業(yè)簡稱

Intel英特爾

中文名稱

英特爾(美國科技公司)官網

原廠標識
數據手冊

下載地址一下載地址二到原廠下載

更新時間

2024-11-19 17:00:00

RD28F1602C3TD70規(guī)格書詳情

Introduction

This document contains the specifications for the Intel? Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations:

? 32-Mbit flash + 8-Mbit SRAM

? 32-Mbit flash + 4-Mbit SRAM

? 16-Mbit flash + 4-Mbit SRAM

? 16-Mbit flash memory + 2-Mbit SRAM

Product Overview

The C3 SCSP device combines flash memory and SRAM into a single package, which provides secure low-voltage memory solutions for portable applications.

The flash memory provides the following features:

? Enhanced security.

? Instant locking/unlocking of any flash block with zero-latency

? A 128-bit protection register that enables unique device identification,

to meet the needs ofnext generation portable applications.

? Improved 12 V production programming for increased factory throughput.

Product Features

■ Flash Memory Plus SRAM

—Reduces Memory Board Space

Required, Simplifying PCB Design

Complexity

■ SCSP Technology

—Smallest Memory Subsystem Footprint

—Area : 8 x 10 mm for 16 Mbit (0.13 μm)

Flash + 2 Mbit or 4 Mbit SRAM

—Area : 8 x 12 mm for 32 Mbit (0.13 μm)

Flash + 4 Mbit or 8 Mbit SRAM

—Height : 1.20 mm for 16 Mbit (0.13 μm)

Flash + 2 Mbit or 4 Mbit SRAM, and 32

Mbit (0.13um) Flash + 8 Mbit SRAM

—Height : 1.40 mm for 32 Mbit (0.13 μm)

Flash + 4 Mbit SRAM

—This Family also includes 0.25 μm, 0.18

μm, and 0.13 μm technologies

■ Advanced SRAM Technology

—70 ns Access Time

—Low Power Operation

—Low Voltage Data Retention Mode

■ Intel? Flash Data Integrator (FDI) Software

—Real-Time Data Storage and Code

Execution in the Same Memory Device

—Full Flash File Manager Capability

■ Advanced+ Boot Block Flash Memory

—70 ns Access Time

—Instant, Individual Block Locking

—128 bit Protection Register

—12 V Production Programming

—Fast Program and Erase Suspend

—Extended Temperature –25 °C to +85 °C

■ Blocking Architecture

—Block Sizes for Code + Data Storage

—4-Kword Parameter Blocks

—64-Kbyte Main Blocks

—100,000 Erase Cycles per Block

■ Low Power Operation

—Asynchronous Read Current: 9 mA (Flash)

—Standby Current: 7 μA (Flash)

—Automatic Power Saving Mode

■ Flash Technologies

—0.25 μm ETOX? VI, 0.18 μm ETOX?

VII and 0.13 μm ETOX? VIII Flash

Technologies

產品屬性

  • 型號:

    RD28F1602C3TD70

  • 制造商:

    INTEL

  • 制造商全稱:

    Intel Corporation

  • 功能描述:

    3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye

供應商 型號 品牌 批號 封裝 庫存 備注 價格
23+
NA
149
專做原裝正品,假一罰百!
詢價
INTEL
22+23+
TSOP
35464
絕對原裝正品全新進口深圳現貨
詢價
INTEL
23+
BGA
30000
代理全新原裝現貨,價格優(yōu)勢
詢價
INT
23+
BGA
4500
全新原裝、誠信經營、公司現貨銷售
詢價
INT
23+
BGA
6500
絕對全新原裝!現貨!特價!請放心訂購!
詢價
INTEL
21+
BGA
1523
公司現貨,不止網上數量!原裝正品,假一賠十!
詢價
INTEL
23+
BGA
8560
受權代理!全新原裝現貨特價熱賣!
詢價
INTEL/英特爾
2402+
BGA
8324
原裝正品!實單價優(yōu)!
詢價
INTEL
19+
BGA
256800
原廠代理渠道,每一顆芯片都可追溯原廠;
詢價
INTEL
23+
65480
詢價