RAK3272P中文資料瑞科慧聯(lián)數(shù)據(jù)手冊(cè)PDF規(guī)格書
| 廠商型號(hào) |
RAK3272P |
| 功能描述 | RAK3272S Breakout Board |
| 文件大小 |
435.96 Kbytes |
| 頁(yè)面數(shù)量 |
7 頁(yè) |
| 生產(chǎn)廠商 | RAKwireless Technology Limited |
| 企業(yè)簡(jiǎn)稱 |
RAK【瑞科慧聯(lián)】 |
| 中文名稱 | 深圳市瑞科慧聯(lián)科技有限公司官網(wǎng) |
| 原廠標(biāo)識(shí) |  |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-6-13 17:20:00 |
| 人工找貨 | RAK3272P價(jià)格和庫(kù)存，歡迎聯(lián)系客服免費(fèi)人工找貨 |
RAK3272P規(guī)格書詳情
RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on the XBee form factor, and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.
The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip. It has Ultra-Low Power
Consumption of 1.69 uA in sleep mode.
This module complies with Class A, B, & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point-to-Point (P2P) communication mode, which helps you in implementing your own customized long-range LoRa network quickly.
Features
Based on RAK3172
Custom firmware using Arduino via RUI3 API
I/O ports: UART/I2C/GPIO/SPI
Serial Wire Debug (SWD) interface
Module size: 25.4 x 32.3 mm
Ultra-low-power consumption of 1.69 μA in sleep mode
Supply Voltage: 2.0 V ~ 3.6 V
Temperature Range: -20 °C ~ 85 °C
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
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21+ |
SOT-363T |
100 |
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詢價(jià) | ||
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54000 |
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45000 |
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21+ |
SOT-363T |
21000 |
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RAK |
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72250 |
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詢價(jià) | ||
VBsemi/臺(tái)灣微碧 |
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12800 |
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HammondManufacturing |
新 |
25 |
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詢價(jià) | |||
RAK |
23+ |
SMT |
11200 |
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54000 |
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詢價(jià) |
