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NTCC201E4中文資料威世科技數(shù)據(jù)手冊(cè)PDF規(guī)格書

NTCC201E4
廠商型號(hào)

NTCC201E4

功能描述

Enhanced Leadless NTC Thermistor Die Suitable for Wire Bonding

文件大小

93 Kbytes

頁面數(shù)量

3

生產(chǎn)廠商 Vishay Siliconix
企業(yè)簡(jiǎn)稱

Vishay威世科技

中文名稱

威世科技半導(dǎo)體官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二原廠數(shù)據(jù)手冊(cè)到原廠下載

更新時(shí)間

2024-11-18 17:30:00

NTCC201E4規(guī)格書詳情

FEATURES

? Flat chip contacted top and bottom

(NTCC201E4 series)

? Green thermistor - does not use RoHS

exemptions

? Wide temperature range from -55 °C to +175 °C

(resistant to repetitive short periods at 200 °C,

as for example, 10 times 10 s)

? Highly resistant to mounting conditions

? Ideal for aluminum wire

? Resistance to leaching during reflow soldering

process

? Delivered on blister tape

? AEC-Q200 qualified

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

? High temperature sensing, control and compensation in

power semiconductor modules (e.g. IGBT, MOSFET,

Diodes, …), inverters in EV/HEV vehicles, and windmills

? IC and semiconductor protecting

? DC/AC power inverters and HIC overheat protecting

DESIGN-IN SUPPORT

For complete curve computation, please visit:

www.vishay.com/thermistors/ntc-curve-list/

MARKING

The thermistors have no marking and have electrode

termination design without orientation.

Wire bonding:

? The silver electrode has been tested for aluminum wire

bonding with a wire diameter of max. 300 μm

Encapsulation:

? In order to preserve the characteristics of the bonded die

at long term an encapsulation is mandatory

? The encapsulation is defined by the user. Silicon and

epoxy encapsulations have been tested. For

recommendations on compatible encapsulants contact

Vishay

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