DDR3 SDRAM

2Gb: x4, x8, x16 DDR3 SDRAM

Features

? VDD= VDDQ= 1.5V ±0.075V

? 1.5V center-terminated push/pull I/O

? Differential bidirectional data strobe

? 8n-bit prefetch architecture

? Differential clock inputs (CK, CK#)

? 8 internal banks

? Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

? Programmable CAS READ latency (CL)

? Posted CAS additive latency (AL)

? Programmable CAS WRITE latency (CWL) based on tCK

? Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])

? Selectable BC4 or BL8 on-the-fly (OTF)

? Self refresh mode

? TC of 0°C to 95°C

– 64ms, 8192 cycle refresh at 0°C to 85°C

– 32ms, 8192 cycle refresh at 85°C to 95°C

? Self refresh temperature (SRT)

? Write leveling

? Multipurpose register

? Output driver calibration