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MPC8360VVAGDGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAGDGA

包裝:散裝 封裝/外殼:740-LBGA 類別:集成電路(IC) 微處理器 描述:IC MPU MPC83XX 400MHZ 740TBGA

NXP USA Inc.

NXP USA Inc.

NXP USA Inc.

MPC8360VVAGDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAGFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAGFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

產(chǎn)品屬性

  • 產(chǎn)品編號:

    MPC8360VVAGDGA

  • 制造商:

    NXP USA Inc.

  • 類別:

    集成電路(IC) > 微處理器

  • 系列:

    MPC83xx

  • 包裝:

    散裝

  • 核心處理器:

    PowerPC e300

  • 內(nèi)核數(shù)/總線寬度:

    1 核,32 位

  • 速度:

    400MHz

  • 協(xié)處理器/DSP:

    通信;QUICC 引擎

  • RAM 控制器:

    DDR,DDR2

  • 圖形加速:

  • 以太網(wǎng):

    10/100/1000Mbps(1)

  • USB:

    USB 1.x(1)

  • 電壓 - I/O:

    1.8V,2.5V,3.3V

  • 工作溫度:

    0°C ~ 105°C(TA)

  • 封裝/外殼:

    740-LBGA

  • 供應(yīng)商器件封裝:

    740-TBGA(37.5x37.5)

  • 描述:

    IC MPU MPC83XX 400MHZ 740TBGA

供應(yīng)商型號品牌批號封裝庫存備注價格
NXP Semiconductors
20+
2000
NXP專賣,進(jìn)口原裝深圳現(xiàn)貨
詢價
FREESCALE
21+
BGA
4
只做原裝,歡迎來電咨詢
詢價
FREESCALE
24+
BGA
4
只做原廠渠道 可追溯貨源
詢價
FREESCAL
24+
BGA
14950
詢價
Freescale(飛思卡爾)
2023+
N/A
4550
全新原裝正品
詢價
NXP(恩智浦)
23+
TBGA-740
921
深耕行業(yè)12年,可提供技術(shù)支持。
詢價
FREESCA
24+
BGA
23000
免費送樣原盒原包現(xiàn)貨一手渠道聯(lián)系
詢價
FREESCAL
23+
BGA
19726
詢價
FREESCALE
BGA740
3102
正品原裝--自家現(xiàn)貨-實單可談
詢價
Freesca
2020+
BGA
2
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可
詢價
更多MPC8360VVAGDG供應(yīng)商 更新時間2025-1-8 10:02:00