MO-192中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書
| 廠商型號 |
MO-192 |
| 功能描述 | The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities |
| 文件大小 |
728.44 Kbytes |
| 頁面數(shù)量 |
2 頁 |
| 生產(chǎn)廠商 | Amkor Technology |
| 企業(yè)簡稱 |
amkor |
| 中文名稱 | Amkor Technology官網(wǎng) |
| 原廠標(biāo)識 |  |
| 數(shù)據(jù)手冊 | |
| 更新時(shí)間 | 2025-1-3 16:20:00 |
MO-192規(guī)格書詳情
FEATURES
Package height down to 0.6 mm
Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices
Established package infrastructure with standard CABGA and fcCSP footprints
Consistent product performance with high yields and reliability
Die overhang wirebonding
Low loop wirebonding to 40 μm or less
Pb-free, RoHS compliant and green materials
Passive component integration options
JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298
Applications
FlipStack? CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.
