MBR140ESF_V01中文資料安森美半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書

This device uses the Schottky Barrier principle with a large area

metal?to?silicon power diode. Ideally suited for low voltage, high

frequency rectification or as free wheeling and polarity protection

diodes in surface mount applications where compact size and weight

are critical to the system. This package also provides an easy to work

with alternative to leadless 34 package style. Because of its small size,

it is ideal for use in portable and battery powered products such as

cellular and cordless phones, chargers, notebook computers, printers,

PDAs and PCMCIA cards. Typical applications are AC?DC and

DC?DC converters, reverse battery protection, and “Oring” of

multiple supply voltages and any other application where performance

and size are critical.

Features

? Guardring for Stress Protection

? Low Reverse Leakage

? 175°C Operating Junction Temperature

? Epoxy Meets UL 94 V?0 @ 0.125 in

? Package Designed for Optimal Automated Board Assembly

? ESD Rating:

? Human Body Model = 3B

? Machine Model = M4

? NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC?Q101

Qualified and PPAP Capable

? These Devices are Pb?Free and are RoHS Compliant*

Mechanical Characteristics

? Device Marking: E4F

? Polarity Designator: Cathode Band

? Weight: 11.7 mg (approximately)

? Case: Epoxy, Molded

? Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

? Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds