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M14256中文資料意法半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書

M14256
廠商型號(hào)

M14256

功能描述

Memory Micromodules General Information for D1, D2 and C Packaging

文件大小

277.48 Kbytes

頁(yè)面數(shù)量

13 頁(yè)

生產(chǎn)廠商 STMicroelectronics
企業(yè)簡(jiǎn)稱

STMICROELECTRONICS意法半導(dǎo)體

中文名稱

意法半導(dǎo)體集團(tuán)官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-4-4 23:00:00

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M14256規(guī)格書詳情

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

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MREL/麥瑞
23+
NA/
3549
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ALI
23+
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8659
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3200
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3000
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16+
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2500
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2447
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100500
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37500
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ALI
94+
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119
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