LBEE5PL2DL-921中文資料村田數(shù)據(jù)手冊PDF規(guī)格書

NXP IW611 Chipset for 802.11a/b/g/n/ac/ax + Bluetooth 5.3 Datasheet - Rev. D

NXP IW611 inside

Supports IEEE 802.11a/b/g/n/ac/ax specifications: Dual band 2.4 GHz and 5 GHz

SISO with 20, 40 and 80 MHz channels

Up to MCS11 data rates (601 Mbps)

Supports Bluetooth specification version 5.3

For supported Bluetooth functions, refer to Bluetooth SIG site

WLAN interface: SDIO 3.0

Bluetooth interface: HCI UART

Temperature Range: - 40 °C to 85 °C

Dimensions: 8.8 x 7.7 x 1.3 mm

Weight: 0.22 g

MSL: 3

Surface-mount type

RoHS compliant

Total Fit : 54