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IS61NLP102418-250B3集成電路(IC)的存儲(chǔ)器規(guī)格書PDF中文資料

IS61NLP102418-250B3
廠商型號(hào)

IS61NLP102418-250B3

參數(shù)屬性

IS61NLP102418-250B3 封裝/外殼為165-TBGA;包裝為托盤;類別為集成電路(IC)的存儲(chǔ)器;產(chǎn)品描述:IC SRAM 18MBIT PARALLEL 165TFBGA

功能描述

256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM

封裝外殼

165-TBGA

文件大小

277.54 Kbytes

頁面數(shù)量

35

生產(chǎn)廠商 Integrated Silicon Solution Inc
企業(yè)簡(jiǎn)稱

ISSI北京矽成

中文名稱

北京矽成半導(dǎo)體有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

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更新時(shí)間

2025-1-30 22:30:00

IS61NLP102418-250B3規(guī)格書詳情

DESCRIPTION

The 18 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSIs advanced CMOS technology.

FEATURES

? 100 percent bus utilization

? No wait cycles between Read and Write

? Internal self-timed write cycle

? Individual Byte Write Control

? Single R/W (Read/Write) control pin

? Clock controlled, registered address, data and control

? Interleaved or linear burst sequence control using MODE input

? Three chip enables for simple depth expansion and address pipelining

? Power Down mode

? Common data inputs and data outputs

? CKE pin to enable clock and suspend operation

? JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages

? Power supply:

NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)

NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)

? JTAG Boundary Scan for PBGA packages

? Industrial temperature available

? Lead-free available

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    IS61NLP102418-250B3

  • 制造商:

    ISSI, Integrated Silicon Solution Inc

  • 類別:

    集成電路(IC) > 存儲(chǔ)器

  • 包裝:

    托盤

  • 存儲(chǔ)器類型:

    易失

  • 存儲(chǔ)器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,SDR

  • 存儲(chǔ)容量:

    18Mb(1M x 18)

  • 存儲(chǔ)器接口:

    并聯(lián)

  • 電壓 - 供電:

    3.135V ~ 3.465V

  • 工作溫度:

    0°C ~ 70°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    165-TBGA

  • 供應(yīng)商器件封裝:

    165-TFBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165TFBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
ISSI
2020+
BGA
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價(jià)
ISSI
23+
165-PBGA(13x15)
71890
專業(yè)分銷產(chǎn)品!原裝正品!價(jià)格優(yōu)勢(shì)!
詢價(jià)
ISSI,
21+
25000
原廠原包 深圳現(xiàn)貨 主打品牌 假一賠百 可開票!
詢價(jià)
ISSI Integrated Silicon Soluti
23+/24+
165-TBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價(jià)
ISSI
18+
BGA
85600
保證進(jìn)口原裝可開17%增值稅發(fā)票
詢價(jià)
ISSI, Integrated Silicon Solu
23+
165-TFBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
ISSI, Integrated Silicon Solu
23+
165-TFBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
ISSI
2022+
原廠原包裝
8600
全新原裝 支持表配單 中國著名電子元器件獨(dú)立分銷
詢價(jià)
ISSI
0430+
BGA
424
一級(jí)代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
詢價(jià)
ISSI
2339+
BGA
5825
公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢(shì)庫存!
詢價(jià)