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IRKN71/10AS90中文資料IRF數(shù)據(jù)手冊(cè)PDF規(guī)格書
IRKN71/10AS90規(guī)格書詳情
Mechanical Description
The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.
Features
■ High Voltage
■ Industrial Standard Package
■ Thick Al metal die and double stick bonding
■ Thick copper baseplate
■ UL E78996 approved
■ 3500VRMS isolating voltage
Benefits
■ Up to 1600V
■ Full compatible TO-240AA
■ High Surge capability
■ Easy Mounting on heatsink
■ Al203 DBC insulator
■ Heatsink grounded
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
IR |
18+ |
2173 |
公司大量全新正品 隨時(shí)可以發(fā)貨 |
詢價(jià) | |||
IR |
22+ |
MODULE |
6000 |
終端可免費(fèi)供樣,支持BOM配單 |
詢價(jià) | ||
IRF |
23+ |
NA |
19960 |
只做進(jìn)口原裝,終端工廠免費(fèi)送樣 |
詢價(jià) | ||
IR |
23+ |
ADD-A-Pak |
10000 |
原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種 |
詢價(jià) | ||
IR |
2015 |
模塊 |
300 |
十七年VIP會(huì)員,誠(chéng)信經(jīng)營(yíng)，一手貨源，原裝正品可零售！ |
詢價(jià) |
