IHLM2525CZRZ1R0ML1中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? Lowest molded height (3.0 mm) in this package footprint

? Shielded construction

? Excellent DC/DC energy storage up to 5 MHz. Filter

inductor applications up to SRF (see “Standard Electrical

Specifications” table)

? Lowest DCR/μH, in this package size

? Handles high transient current spikes without saturation

? Ultra low buzz noise, due to composite construction

? Tin/Lead Sn/Pb plated (not dipped) terminals

? Encapsulated body offers improved environmental

protection and moisture resistance

? Higher dielectric withstanding voltage vs IHLP

? Flame retardant encapsulant (UL 94V-0)

? Corrosion resistant package

? IHLP design. PATENT(S): www.vishay.com/patents

APPLICATIONS

? PDA / notebook / desktop / server applications

? High current POL converters

? Low profile, high current power supplies

? Battery powered devices

? DC/DC converters in distributed power systems

? DC/DC converter for field programmable gate array

(FPGA)

? Harsh environments including moisture, chemicals and

salt spray