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HP5-123S-1.27W中文資料廣瀨數(shù)據(jù)手冊(cè)PDF規(guī)格書

HP5-123S-1.27W
廠商型號(hào)

HP5-123S-1.27W

功能描述

High-density Packaging System

文件大小

1.2631 Mbytes

頁面數(shù)量

34

生產(chǎn)廠商 Hirose Electric Company
企業(yè)簡(jiǎn)稱

HIROSE廣瀨

中文名稱

日本廣瀨電機(jī)株式會(huì)社官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-4 19:10:00

HP5-123S-1.27W規(guī)格書詳情

High-density Packaging System

Connectors for Hi-PAS Mounting

Overview

The HP5 Series and C-G Series of Hi-PAS (High-density Packaging System) mounting connectors were developed to meet the demands of the high performance and trend toward high-density packaging of communications equipment.

Applications

Exchange equipment, transmission equipment, measuring instruments, control equipment, etc.

產(chǎn)品屬性

  • 型號(hào):

    HP5-123S-1.27W

  • 制造商:

    HRS

  • 制造商全稱:

    HRS

  • 功能描述:

    High-density Packaging System

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KEEPER
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