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HIN200IB

5VPoweredRS-232Transmitters/Receiverswith0.1MicrofaradExternalCapacitors

Description TheHIN200-HIN213familyofRS-232transmitters/receiversinterfacecircuitsmeetallElARS-232EandV.28specifications,andareparticularlysuitedforthoseapplicationswhere±12Visnotavailable.Theyrequireasingle+5Vpowersupply(exceptHIN201andHIN209)andfeatureon

HARRIS

Harris Corporation

HIRP200

UNIVERSALINPUTHARMONICCORRECTIONRESONANTAC-DCOPENFRAMETRIPLEOUTPUT200WATTSINTERNALSWITCHINGPOWERSUPPLIES

HITRON

HITRON ELECTRONICS CORPORTION

HJF-A-200

0/180POWERDIVIDERS/COMBINERS

MERRIMAC

Merrimac Industries, Inc.

HLMP-M200

4mmFLATTOPLAMPS

QT

QT Optoelectronics

HLMP-M200

4mmFLATTOPLAMPS

DESCRIPTION Brightilluminationandwideviewinganglearetwooutstandingfeaturesofthe4mmflattoplamps.Thecylindricalshapeandflatemittingsurfacemaketheselampsparticularlywellsuitedforapplicationsrequiringhighlightoutputinminimalspace. FEATURES ?Wideviewingangle

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

HLMP-S200

2mmx5mmRectangularLEDLamps

Description TheHLMP-S100,-S200,-S300,-S400,-S500,S600areepoxyencapsulatedlampsinrectangularpackageswhichareeasilystackedinarraysorusedfordiscretefrontpanelindicators.Contrastandlightuniformityareenhancedbyaspecialepoxydiffusionandtintingprocess. Feat

HPAgilent(Hewlett-Packard)

安捷倫科技安捷倫科技有限公司

HLMP-S200

2mmx5mmRectangularLEDLamps

HPAgilent(Hewlett-Packard)

安捷倫科技安捷倫科技有限公司

HMB-E200

2UComputeSledforHTCA-E400

Features ?Support3rdGenIntelXeonScalableProcessor(codenamedIcelake) ?FrontAccessI/O:Storagebaysx4,PCIex1,NICslotx1,mini-DPport (VGAsignal),LOMandUSB3.0ports ?SupportFH3/4LdoublewidthorsinglewidthPCIeCard ?SupportOCPNIC3.0Modules ?CompatiblewithHT

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HMB-E200A

2UComputeSledforHTCA-E400

Features ?Support3rdGenIntelXeonScalableProcessor(codenamedIcelake) ?FrontAccessI/O:Storagebaysx4,PCIex1,NICslotx1,mini-DPport (VGAsignal),LOMandUSB3.0ports ?SupportFH3/4LdoublewidthorsinglewidthPCIeCard ?SupportOCPNIC3.0Modules ?CompatiblewithHT

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HMB-E200A

Carrier-gradeEdgeServerChassisforOpenRAN/MEC

Features ?Carrier-grade,fullredundancyandextremehighperformance ?3rdGenerationIntel?Xeon?ScalableProcessorwithAIAcceleration ?Support5x1Ucomputesledsor2x2U+1Ucomputesleds ?Support2x1Uswitchsledsforredundancy ?SupportOCPNIC3.0Modules,2UsledSupportFH3/4

LANNER

Lanner All Rights Reserved.

供應(yīng)商型號品牌批號封裝庫存備注價格
SAMSUNG
2016+
5632
只做進口原裝正品!現(xiàn)貨或者訂貨一周貨期!只要要網(wǎng)上有
 詢價
SAMSUNG/三星
2022+
3250
全新原裝 貨期兩周
 詢價
SAMSUNG
ROHS
56520
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨
 詢價
SAMSUNG
16+
TQFP
712
進口原裝現(xiàn)貨/價格優(yōu)勢!
 詢價
RENESAS
23+
BGAQFP
8659
原裝公司現(xiàn)貨!原裝正品價格優(yōu)勢.
 詢價
RENESAS
1922+
TQFP
488
原盒原包裝只有原裝假一罰十價優(yōu)!
 詢價
SAMSUNG
24+
TQFP
6500
獨立分銷商 公司只做原裝 誠心經(jīng)營 免費試樣正品保證
 詢價
EMC-RFLABS
23+
EMC-RFLABS原封
9808
原廠授權(quán)代理分銷現(xiàn)貨只做原裝正邁科技樣品支持現(xiàn)貨
 詢價
EMC RFLABS
21+
-
122
全新原裝鄙視假貨15118075546
 詢價
Smiths
2405+
原廠封裝
12500
15年芯片行業(yè)經(jīng)驗/只供原裝正品:0755-83267371鄒小姐
 詢價
更多HDIM200U供應(yīng)商 更新時間2025-3-25 17:01:00

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