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HSC276A

SiliconSchottkyBarrierDiodeforMixer

Features ?Highforwardcurrent,Lowcapacitance. ?UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSD276A

SiliconSchottkyBarrierDiodeforDetector

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSD276A

SiliconSchottkyBarrierDiodeforDetector

HitachiHitachi Semiconductor

日立日立公司

HSL276A

SiliconSchottkyBarrierDiodeforDetector

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSM276AS

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSM276AS

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSM276ASR

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSM276ASR

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSM276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSM276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
EG
2447
to-94
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
 詢價(jià)
EG(屹晶微)
2021+
To-94
709
詢價(jià)
EG屹晶微
23+
To-94
22820
原裝正品，支持實(shí)單
 詢價(jià)
24+
N/A
56000
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
 詢價(jià)
EG(屹晶微)
22+
TO-94
310
電機(jī)驅(qū)動(dòng) 百分之百原裝現(xiàn)貨
 詢價(jià)
EG/屹晶微
24+
TO-94
800000
原裝正品,原廠發(fā)貨
 詢價(jià)
EG(屹晶微)
2025+
TO-94
27975
詢價(jià)
MICREL
05/06+
SOT-23
806
全新原裝100真實(shí)現(xiàn)貨供應(yīng)
 詢價(jià)
MICREL
25+
SOT-23
1000
⊙⊙新加坡大量現(xiàn)貨庫(kù)存,深圳常備現(xiàn)貨!歡迎查詢!⊙
 詢價(jià)
進(jìn)口原裝
23+
SOT23-5
1524
全新原裝現(xiàn)貨
 詢價(jià)
更多EG276供應(yīng)商 更新時(shí)間2025-4-25 15:00:00

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