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DG2501中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

DG2501
廠商型號

DG2501

功能描述

200 ?? Low Leakage, Low Parasitic and Low Charge Injection, Quad SPST Analog Switches

文件大小

201.21 Kbytes

頁面數(shù)量

10

生產(chǎn)廠商 Vishay Siliconix
企業(yè)簡稱

Vishay威世科技

中文名稱

威世科技半導(dǎo)體官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-18 9:22:00

DG2501規(guī)格書詳情

FEATURES

? 1.8 V to 5.5 V single supply operation

? Low leakage, 1 nA / max. at 85 °C

? Low switch off capacitance

? Rail-to-rail signal handling

? Latch up current > 800 mA (JESD78)

? ESD: 8000 V/HBM

? Typical power consumption (< 0.01 μW)

? TTL/CMOS compatible

? Compact WCSP16 1.44 mm x 1.44 mm

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

? Analog front end signal switching

? Sample-and-hold circuits

? Battery-powered systems

? Portable meters

? Automatic test equipment

? Medical and healthcare equipment

? Communication systems

DESCRIPTION

The DG2501, DG2502, and DG2503 are monolithic quad

single-pole single-throw (SPST) analog switches that

operate from a single 1.8 V to 5.5 V power supply.

These switches are fully specified at 3 V and 5 V. The parts

feature low parasitic capacitance, low charge injection, and

low leakage performance over the full operating

temperature range of -40 °C to +85 °C. Their ESD/HBM

tolerance is over 8 kV.

The DG2501, DG2502, and DG2503 each feature four

independently selectable SPST switches with closely

matched channel resistance. The DG2501 is normally

closed, while the DG2502 is normally open.

The DG2503 has two normally open and two normally

closed switches. All parts are guaranteed

break-before-make operation for use in multiplexer

applications. The parts have a guaranteed control logic high

of 1.4 V when V+ is 3 V and 1.8 V when V+ is 5 V.

Each switch conducts equally well in both directions when

on, and each has an input signal range that extends to the

supplies.

The DG2501, DG2502, and DG2503 are ideal for portable

healthcare, instrument, and communication devices.

The DG2501, DG2502, and DG2503 are available in wafer

level CSP package with top side lamination.

The package has a 4 x 4 bump array, 0.35 mm pitch, and

1.44 mm x 1.44 mm length and width.

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