DF6S25P3NU中文資料東芝數(shù)據(jù)手冊PDF規(guī)格書

Applications

Mobile Equipment

Smartphones

Tablets

Notebook PCs

Desktop PCs

Features

(1) Suitable for use with a 20 V signal line. (VRWM ≤ 22 V)

(2) Protects devices with its high ESD performance.

(VESD = ±30 kV (Contact / Air) @IEC61000-4-2)

(3) Low dynamic resistance protects semiconductor devices from static electricity and noise.

(RDYN = 0.01 Ω (typ.))

(4) Snapback characteristics realizing low clamping voltage protects semiconductor devices.

(VC = 42 V@IPP = 110 A (typ.))

(5) Compact package is suitable for use in high density board layouts such as in mobile devices.

(2.0 mm × 2.0 mm size (Nickname: UDFN6B))