零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
CPDF | SMD ESD Protection Diode Features (16kV)IEC61000-4-2rating. Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:1005(2512)Standardpackage, moldedplastic. Terminals:Goldplated,solderableper MIL-STD-750,method2026. MarkingC | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | |
SMD ESD Protection Diode Features (16kV)IEC61000-4-2rating. Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:1005(2512)Standardpackage, moldedplastic. Terminals:Goldplated,solderableper MIL-STD-750,method2026. MarkingC | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Uni-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&E12 -Mountingposition: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&am | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Bi-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: CPDF5V0-HF:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features (16kV)IEC61000-4-2rating. Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:1005(2512)Standardpackage, moldedplastic. Terminals:Goldplated,solderableper MIL-STD-750,method2026. MarkingC | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode RoHSDevice HalogenFree Features -Uni-directionalESDprotection -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323FStandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -Mountingposition:Any. -We | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Bi-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: CPDF5V0-HF:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features (16kV)IEC61000-4-2rating. Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:1005(2512)Standardpackage, moldedplastic. Terminals:Goldplated,solderableper MIL-STD-750,method2026. MarkingC | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode RoHSDevice HalogenFree Features -Workingvoltage:3.3V -Lowleakagecurrent. -Lowoperatingandclampingvoltages. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -Markingcode:E3V3 -Mountin | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features (16kV)IEC61000-4-2rating. Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:1005(2512)Standardpackage, moldedplastic. Terminals:Goldplated,solderableper MIL-STD-750,method2026. MarkingC | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode RoHSDevice HalogenFree Features -Bi-directionalESDprotection. -Surfacemountpackage. -Operatingvoltage:5V. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:CPDF5V0C-HF:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Bi-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: CPDF5V0-HF:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode RoHSDevice HalogenFree Features -Bi-directionalESDprotection -IEC61000-4-5(surge);IPP=7A -IEC61000-4-2(ESD);±30KV(contact) -Lowclampingvoltage -Lowleakagecurrent Mechanicaldata -Case:1005/SOD-323FStandardpackage,moldedplastic. -Terminals:Goldplated,solder | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Uni-directionalESDprotection -Workingvoltage:5V -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&E | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features Halogenfree. Uni-directionalESDprotection IEC61000-4-215kV(contact),20kV(air). Workingvoltage:5V Surfacemountpackage. Highcomponentdensity. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderablepe | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Bi-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: CPDFR5V0:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Bi-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: CPDFR5V0:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode RoHSDevice HalogenFree Features -Bi-directionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMD ESD Protection Diode Features -Bi-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode: CPDFR5V0:E05 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
詳細(xì)參數(shù)
- 型號(hào):
CPDF
- 制造商:
COMCHIP
- 制造商全稱:
Comchip Technology
- 功能描述:
SMD ESD Protection Diode
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
Comchip |
23+ |
CPDFR5V0 |
7750 |
全新原裝優(yōu)勢(shì) |
詢價(jià) | ||
Comchip |
24+ |
1005SOD-323F |
5000 |
全現(xiàn)原裝公司現(xiàn)貨 |
詢價(jià) | ||
COMCHIP |
2018+ |
SOD323 |
6528 |
只做原裝正品假一賠十!只要網(wǎng)上有上百分百有庫(kù)存放心 |
詢價(jià) | ||
COMCHIP |
2010 |
SOD |
200000 |
詢價(jià) | |||
Comchip |
2019+PBHF |
SOD323 |
7318 |
向鴻代理渠道,有現(xiàn)貨常備料,優(yōu)勢(shì)料 |
詢價(jià) | ||
COMCHIP/典琦科技 |
24+ |
SOD323 |
900000 |
原裝進(jìn)口特價(jià) |
詢價(jià) | ||
Comchip |
20+ |
FBP |
36800 |
原裝優(yōu)勢(shì)主營(yíng)型號(hào)-可開原型號(hào)增稅票 |
詢價(jià) | ||
COMCHIP |
2023+ |
SOD |
80000 |
一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品 |
詢價(jià) | ||
COMCHIP |
20+ |
SOD-323 |
4000 |
就找我吧!--邀您體驗(yàn)愉快問購(gòu)元件! |
詢價(jià) | ||
COMCHIP/典琦科技 |
22+ |
1005SOD-323F |
9600 |
原裝現(xiàn)貨,優(yōu)勢(shì)供應(yīng),支持實(shí)單! |
詢價(jià) |
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相關(guān)庫(kù)存
更多- CPDF5V0U
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