首頁 >CHK-701N>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
PEGODAContactlessSmartCardReader | PhilipsPhilips Semiconductors 飛利浦荷蘭皇家飛利浦 | Philips | ||
Rondaseries | CreeCree, Inc 科銳 | Cree | ||
CARMENseries | CreeCree, Inc 科銳 | Cree | ||
LowPowerOscillator | RALTRONRaltron Electronics Corporation 拉隆 | RALTRON | ||
SmallSignalTransistorsPNP-HighVoltageTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize26x26MILS DieThickness9.0MILS BaseBondingPadArea6.1x4.9MILS EmitterBondingPadArea5.2x5.2MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-18,000? | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
0.6AMOSFET/IGBTGateDriverOptocoupler | CTMICRO CT Micro International Corporation | CTMICRO | ||
Monolithic16-BitDIGITAL-TO-ANALOGCONVERTERS | BURR-BROWN Burr-Brown (TI) | BURR-BROWN | ||
Monolithic16-BitDIGITAL-TO-ANALOGCONVERTERS | TITexas Instruments 德州儀器美國德州儀器公司 | TI | ||
Monolithic16-BitDIGITAL-TO-ANALOGCONVERTERS | BURR-BROWN Burr-Brown (TI) | BURR-BROWN | ||
Monolithic16-BitDIGITAL-TO-ANALOGCONVERTERS | TITexas Instruments 德州儀器美國德州儀器公司 | TI |
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
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