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零件編號(hào)	下載&訂購(gòu)	功能描述	制造商&上傳企業(yè)	LOGO
CDBER0140L	文件：193.26 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0140L-HF	文件：193.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0140R	文件：126.37 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderablep	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0140R-HF	文件：195.43 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140L	文件：151.03 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140L-HF	文件：195.14 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA RoHSDevice HalogenFree VR=40Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,Moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140R	文件：150.83 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140R-HF	文件：195.26 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140L	文件：72.66 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, Moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140L-HF	文件：123.39 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, Moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140R	文件：72.7 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140R-HF	文件：123.55 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBK0140L	文件：195.12 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Terminals:Goldplated,solderableperMIL-STD-750,method2026. Case:SOD-123Fstandardpackage	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBK0140R	文件：195.27 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-123Fstandardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-7	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0140L-HF	文件：476.33 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0140R-HF	文件：103 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L	文件：193.71 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L	文件：123.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L-HF	文件：123.08 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L-HF	文件：193.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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晶體管資料

型號(hào)：
BSTCC0140R
別名：
三極管、晶體管、晶體三極管
生產(chǎn)廠家：
制作材料：
F-Thy+Di
性質(zhì)：
電視（TV）_行輸出（HA）
封裝形式：
直插封裝
極限工作電壓：
600V
最大電流允許值：
3.2A
最大工作頻率：
<1MHZ或未知
引腳數(shù)：
2
可代換的型號(hào)：
S6087A,TD3F600R,TD4F600R,
最大耗散功率：
放大倍數(shù)：
圖片代號(hào)：
E-43
vtest：
600
htest：
999900
atest：
3.2
wtest：
0

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫(kù)存	備注	價(jià)格
艾睿國(guó)際（香港）有限公司	BSTCM-106-S-215-20-GT-450-S-LF	MAJORLEAGUE	2021+	SMD	100500	一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨	詢價(jià)
深圳市凌旭科技有限公司	BSTCM-202-D-168-38-GT-437-TR-P	MAJORLEAGUEELECTRONICS	21+	NA	5100	只做原裝,一定有貨,不止網(wǎng)上數(shù)量,量多可訂貨!	詢價(jià)
標(biāo)準(zhǔn)國(guó)際(香港)有限公司	BSTCM-6		0003-		624	公司優(yōu)勢(shì)庫(kù)存熱賣(mài)中!	詢價(jià)
深圳芯力源電子科技有限公司	BSTCM630D14GT311	MAJORLEAGU	23+	原廠封裝	5177	現(xiàn)貨	詢價(jià)
貿(mào)澤芯城（深圳）電子科技有限公司	BSTCR-110-D-090-20-GT-210	N/A	23+	new	10000	原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種	詢價(jià)
深圳市百諾芯科技有限公司	BSTCR-117-D-160-22-GT-300-LF	MAJORLEAGUEELECTRONICS	23+	NA	12730	原裝正品代理渠道價(jià)格優(yōu)勢(shì)	詢價(jià)
深圳市鼎盛源芯科技有限公司	BST-D	原廠	16+	原廠封裝	10000	全新原裝正品,代理優(yōu)勢(shì)渠道供應(yīng),歡迎來(lái)電咨詢	詢價(jià)
上海金慶電子技術(shù)有限公司	BST-D		新		5	全新原裝貨期兩周	詢價(jià)
上海市鑫鴻達(dá)電子	BST-D		2022+		1	全新原裝貨期兩周	詢價(jià)
深圳市弘揚(yáng)芯城科技有限公司	BST-D	IDEC(日本和泉)	23+		6000	誠(chéng)信服務(wù)，絕對(duì)原裝原盤(pán)	詢價(jià)

更多BSTCC0140R供應(yīng)商更新時(shí)間2024-11-17 11:00:00

晶體管資料

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