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BL317BY-T

HIGH CURRENT ADJUSTABLE VOLTAGE REGULATOR

BellingSHANGHAI BELLING CO., LTD.

上海貝嶺上海貝嶺股份有限公司

BL317BY-T

HIGH CURRENT ADJUSTABLE VOLTAGE REGULATOR

BellingSHANGHAI BELLING CO., LTD.

上海貝嶺上海貝嶺股份有限公司

BL317L

3-TERMINALADJUSTABLEOUTPUTPOSITIVEVOLTAGE

BellingSHANGHAI BELLING CO., LTD.

上海貝嶺上海貝嶺股份有限公司

BL-L317

3.0mmRoundTypeBI-COLORLEDLamps,with2leads

BETLUX

BetLux Electronics

BL-L317EGW

RoundType,BI-COLORLEDlamp

BETLUX

BetLux Electronics

BL-L317EGW

3.0mmRoundTypeBI-COLORLEDLamps,with2leads

BETLUX

BetLux Electronics

BL-L317UEUGW

RoundType,BI-COLORLEDlamp

BETLUX

BetLux Electronics

BL-L317UEUGW

3.0mmRoundTypeBI-COLORLEDLamps,with2leads

BETLUX

BetLux Electronics

BL-L317YGW

RoundType,BI-COLORLEDlamp

BETLUX

BetLux Electronics

BL-L317YGW

3.0mmRoundTypeBI-COLORLEDLamps,with2leads

BETLUX

BetLux Electronics

BSP317

SIPMOSSmall-SignalTransistor(PchannelEnhancementmodeLogicLevel)

SIPMOS?Small-SignalTransistor ?Pchannel ?Enhancementmode ?LogicLevel ?VGS(th)=-0.8...-2.0V

SIEMENSSiemens Semiconductor Group

西門子德國西門子股份公司

BSP317P

SIPMOSSmall-Signal-Transistor

Feature ?P-Channel ?Enhancementmode ?LogicLevel ?dv/dtrated ?Pb-freeleadplating;RoHScompliant ?QualifiedaccordingtoAECQ101

InfineonInfineon Technologies AG

英飛凌英飛凌科技股份公司

BSP317P

SIPMOSSmall-Signal-Transistor

InfineonInfineon Technologies AG

英飛凌英飛凌科技股份公司

C317

MILITARYSPECIFCATIONSONBACK

KEMETKEMET Corporation

基美基美公司

C317

MULTILAYERCERAMICCAPACITORS/AXIAL&RADIALLEADED

KEMETKEMET Corporation

基美基美公司

C317

AluminumElectrolyticCapacitors

KEMETKEMET Corporation

基美基美公司

CMD317

WCSDuplexer

APITECH

API Technologies Corp

CMD317

1-24GHzDistributedDriverAmplifier

QORVO

Qorvo, Inc

CP317

SmallSignalTransistorNPN-RFTransistorChip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize14.5x14.5MILS DieThickness9.0MILS BaseBondingPadArea2.4x2.2MILS EmitterBondingPadArea2.4x2.2MILS TopSideMetalization

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CP317V

NPN-RFTransistorChip

SmallSignalTransistor NPN-RFTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize14.5x14.5MILS DieThickness7.1MILS BaseBondingPadArea2.4x2.2MILS EmitterBondin

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
BL
23+
TO-252
8560
受權(quán)代理!全新原裝現(xiàn)貨特價(jià)熱賣!
詢價(jià)
BELING/上海貝嶺
24+
TO92
15000
原裝正品原廠發(fā)貨
詢價(jià)
BELLING/上海貝嶺
23+
TO92
96656
原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢訂貨,價(jià)格優(yōu)勢、品種
詢價(jià)
Shanghai Belling Co(Belling)
22+
NA
500000
萬三科技,秉承原裝,購芯無憂
詢價(jià)
BL
24+
DIP-8
6520
詢價(jià)
BL
06+
DIP-8
3300
全新原裝現(xiàn)貨100真實(shí)自己公司
詢價(jià)
-
16+
DIP
1068
原裝現(xiàn)貨假一罰十
詢價(jià)
BL
1215+
DIP
150000
全新原裝,絕對正品,公司大量現(xiàn)貨供應(yīng).
詢價(jià)
BL
23+
DIP-8
5000
原裝正品,假一罰十
詢價(jià)
BL
DIP-8
27413
只做原裝貨值得信賴
詢價(jià)
更多BL317BY-T供應(yīng)商 更新時(shí)間2024-12-23 14:59:00