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BES0145

Inductive Sensors

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團

CDBF0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0145-HF

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Termi

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Te

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0145-HF

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. (IR=0.1uAtyp.@VR=10V) -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedpla

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBN0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method2

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0145-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBUR0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Te

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供應商型號品牌批號封裝庫存備注價格
BALLUFF
24+
con
2000
優(yōu)勢庫存,原裝正品
 詢價
24+
N/A
80000
一級代理-主營優(yōu)勢-實惠價格-不悔選擇
 詢價
BORN
22+
DFN2×2-3L
25000
伯恩全系列在售
 詢價
BORN
22+
DFN2×2-3L
20000
原裝正品假一罰十,代理渠道價格優(yōu)
 詢價
SXSEMI
24+
DFN2020
900000
原裝進口特價
 詢價
APPLIED MATERIALS (AMAT)
NDC
80
公司優(yōu)勢庫存 熱賣中!
 詢價
24+
36000
詢價
CHINAXYJ
23+
1608
9868
專做原裝正品,假一罰百!
 詢價
BES
23+
BGA
15000
全新原裝現(xiàn)貨,價格優(yōu)勢
 詢價
BES
22+
QFN
8000
原裝正品支持實單
 詢價
更多BES0145供應商 更新時間2025-3-24 9:00:00

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