B4003-8C中文資料ETC數(shù)據(jù)手冊PDF規(guī)格書

Features:

Now available in: SMA (27 GHz), 2.92 mm (40 GHz), 2.40 mm (50 GHz)

and 1.85 mm (67 GHz)

Multiple launch configurations to optimize match to circuit

Optimum performance when board launch geometry is

grounded coplanar (CPWG) or top ground microstrip

Unique clamping mechanism accommodates a wide range of

board thicknesses (up to .110”) while providing a continuous

ground connection between end launch and circuit board.

Launch overhang that allows ground to be picked up close

to the launch point

Universal, robust & reusable

No soldering required

Connectors ship fully assembled (board not included)

Examples of Applications

Chip set evaluation demo boards.

Board characterization.

Internal board launch (not limited to perimeter board edge).

Custom flanges available.