首頁 >ACDBQC0240LR-HF>規(guī)格書列表
零件編號(hào) | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
ACDBQC0240LR-HF | SMD Schottky Barrier Diode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | |
SMDSchottkyBarrierDiode Features IO=200mA VR=40V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Termin | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
WirewoundResistors,IndustrialPower,SiliconeCoated,AdjustableEdgewoundTubular | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
WirewoundResistors,IndustrialPower,VitreousCoated | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
BLP0240 BLP0240 | BellingSHANGHAI BELLING CO., LTD. 上海貝嶺上海貝嶺股份有限公司 | Belling | ||
ApprovalProductSpecification GeneralDescription: ?DrivingMode:ActiveMatrix. ?ColorMode:FullColor(262Kcolor) ?DriverIC:S6E63D6,COGAssembly ?Interface: 1.MPUi80-system18-/16-/9-/8-bitbusinterface 2.MPUi68-system18-/16-/9-/8-bitbusinterface 3.Serialdatatransferinterface(SPI) | AZDISPLAYS AZ Displays | AZDISPLAYS | ||
ApprovalProductSpecification Purpose: ThisdocumentationdefinesgeneralproductspecificationforOLEDmodulesuppliedbyCMEL.Theinformationdescribedinthistechnicalspecificationistentative.PleaseContactCMEL’srepresentativewhileyourproductismodified. GeneralDescription: ■DrivingMode:ActiveMatrix. ■ | AZDISPLAYS AZ Displays | AZDISPLAYS | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750, | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
LowVFSMDSchottkyDiodes | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603(1608)Standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method20 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features -Lowstoredcharge. -Majoritycarrierconduction. -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowforwardvoltage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SWITCH-BASIC | HoneywellHoneywell Solid State Electronics Center 霍尼韋爾霍尼韋爾國際 | Honeywell |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
SXSEMI |
24+ |
DFN2 |
900000 |
原裝進(jìn)口特價(jià) |
詢價(jià) | ||
Comchip Technology |
24+ |
0402C/SOD-923F |
9350 |
獨(dú)立分銷商 公司只做原裝 誠心經(jīng)營 免費(fèi)試樣正品保證 |
詢價(jià) | ||
24+ |
N/A |
47000 |
一級代理-主營優(yōu)勢-實(shí)惠價(jià)格-不悔選擇 |
詢價(jià) | |||
COMCHIP |
1809+ |
SOT-23 |
6675 |
就找我吧!--邀您體驗(yàn)愉快問購元件! |
詢價(jià) | ||
Comchip |
22+ |
NA |
3000 |
加我QQ或微信咨詢更多詳細(xì)信息, |
詢價(jià) | ||
COMCHIPTECH |
24+ |
8600 |
正品原裝,正規(guī)渠道,免費(fèi)送樣。支持賬期,BOM一站式配齊 |
詢價(jià) | |||
MAXIM |
2020+ |
STO23-5 |
200 |
百分百原裝正品 真實(shí)公司現(xiàn)貨庫存 本公司只做原裝 可 |
詢價(jià) | ||
24+ |
MODULE |
2100 |
公司大量全新現(xiàn)貨 隨時(shí)可以發(fā)貨 |
詢價(jià) | |||
模塊 |
256 |
原裝 原裝 原裝 只做原裝現(xiàn)貨 |
詢價(jià) | ||||
SILERGY/矽力杰 |
2300 |
原裝正品,原包原標(biāo),價(jià)格優(yōu)勢,實(shí)單支持!假一賠十 |
詢價(jià) |
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