Features

? 3-level topology

? ACEPACK 2 power module

– 13 mΩ of typical RDS(on) each switch

– Insulation voltage UL certified of 2.5 kVrms

– Integrated NTC temperature sensor

– DBC Cu-Al2O3-Cu based

– Press fit contact pins

Description

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter

topology that integrates the advanced silicon carbide Power MOSFET technology

from STMicroelectronics. This module leverages the innovative properties of the

wide-bandgap SiC material and a high-thermal-performance substrate. The result is

exceptionally low on-resistance per unit area and excellent switching performance

that is virtually independent of temperature. An NTC sensor completes the design.

Applications

? DC/DC converter

A2U12M12W2-F2屬于分立半導體產(chǎn)品 > 晶體管 - IGBT - 模塊。意法半導體（ST）集團制造生產(chǎn)的A2U12M12W2-F2晶體管 - IGBT - 模塊絕緣柵雙極晶體管 (IGBT) 是三端功率半導體器件，主要用作電子開關，兼具高效率和快速切換優(yōu)點。作為模塊，IGBT 配置為非對稱式橋； 升壓、降壓和制動斬波器；全橋、三電平和三相逆變器。有些器件內置了用于監(jiān)控溫度的 NTC 熱敏電阻。IGBT 模塊可根據(jù)最大功率、集電極電流、集射擊穿電壓和配置進行區(qū)分。