935146521410-E1T中文資料村田數(shù)據(jù)手冊(cè)PDF規(guī)格書

? Compatible with MLCC footprint

? Ultra-high stability of capacitance value:

? Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to

+150 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through

ageing

? Low profile 250μm or 100μm

? Small size 0.5 x 0.5 mm (0202 format)

? Break down voltage : 150V

? Low leakage current

? High reliability

? High operating temperature

(up to 150 °C)

? Compatible with high temperature

cycling during manufacturing

operations (exceeding 300 °C)

? Compatible with EIA 0202 footprint

? Applicable for standard wire bonding assembly (ball and wedge)