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935142521310-F1T中文資料村田數據手冊PDF規(guī)格書
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935142521310-F1T規(guī)格書詳情
? Compatible with MLCC footprint
? Ultra-high stability of capacitance value:
o Temperature 70ppm/K (-55 °C to
+150 °C)
o Voltage <0.02/Volt
? Negligible capacitance loss through
ageing
? Low profile 250μm or 100μm
? Small size 0.5 x 0.5 mm (0202 format)
? Break down voltage : 150V
? Low leakage current
? High reliability
? High operating temperature
(up to 150 °C)
? Compatible with high temperature
cycling during manufacturing
operations (exceeding 300 °C)
? Compatible with EIA 0202 footprint
? Applicable for standard wire bonding assembly (ball and wedge)
